Kaidong Xu

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing apparatus and method
- Patent number 10,734,253
- Issue date Aug 4, 2020
- JIANGSU LEUVEN INSTRUMENTS CO. LTD
- Kaidong Xu
- B08 - CLEANING
Information Patent Grant
Method of providing an implanted region in a semiconductor structure
- Patent number 9,520,291
- Issue date Dec 13, 2016
- Imec VZW
- Zheng Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER CUTTING DEVICE AND METHOD
- Publication number 20190157126
- Publication date May 23, 2019
- JIANGSU LEUVEN INSTRUMMENTS CO. LTD
- Kaidong XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND METHOD
- Publication number 20190088508
- Publication date Mar 21, 2019
- JIANGSU LEUVEN INSTRUMENTS CO. LTD
- Kaidong XU
- B08 - CLEANING
Information Patent Application
Method of Providing An Implanted Region In A Semiconductor Structure
- Publication number 20160196975
- Publication date Jul 7, 2016
- IMEC vzw
- Zheng Tao
- H01 - BASIC ELECTRIC ELEMENTS