Kailei Zhang

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with top die positioned to reduce die cracking
- Patent number 11,177,241
- Issue date Nov 16, 2021
- Western Digital Technologies, Inc.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING
- Publication number 20230411169
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TOP DIE POSITIONED TO REDUCE DIE CRACKING
- Publication number 20200381401
- Publication date Dec 3, 2020
- Western Digital Technologies, Inc.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS