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Kaiming Luo
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Singapore, SG
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last 30 patents
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Patent Grant
Microelectronic devices with tiered blocks separated by progressive...
Patent number
11,641,741
Issue date
May 2, 2023
Micron Technology, Inc.
Kaiming Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated assemblies and methods of forming integrated assemblies
Patent number
11,600,630
Issue date
Mar 7, 2023
Micron Technology, Inc.
Jordan D. Greenlee
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
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Patent Application
SUPPORT STRUCTURES FOR TIER DEFLECTION IN A MEMORY SYSTEM
Publication number
20240357809
Publication date
Oct 24, 2024
Micron Technology, Inc.
Zeyar Lin Aung
Information
Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
Publication number
20230164991
Publication date
May 25, 2023
Micron Technology, Inc.
Jordan D. Greenlee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES WITH TIERED BLOCKS SEPARATED BY PROGRESSIVE...
Publication number
20220077178
Publication date
Mar 10, 2022
Micron Technology, Inc.
Kaiming Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
Publication number
20220045075
Publication date
Feb 10, 2022
Micron Technology, Inc.
Jordan D. Greenlee
G11 - INFORMATION STORAGE