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Kaitlyn M. Fisher
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Marion, IA, US
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last 30 patents
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Patent Grant
Integrated circuit (IC) package with cantilever multi-chip module (...
Patent number
11,948,855
Issue date
Apr 2, 2024
Rockwell Collins, Inc.
Bret W. Simon
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
DIE LEVEL CAVITY HEAT SINK
Publication number
20230163040
Publication date
May 25, 2023
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
Alan P. Boone
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SELECTIVE HEAT SINK
Publication number
20230163041
Publication date
May 25, 2023
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
Jacob R. Mauermann
H01 - BASIC ELECTRIC ELEMENTS