Kaladhar Radhakrishnan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Two stage multi-input multi-output regulator
- Patent number 12,074,514
- Issue date Aug 27, 2024
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase switching regulators with hybrid inductors and per phas...
- Patent number 12,068,684
- Issue date Aug 20, 2024
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,955,426
- Issue date Apr 9, 2024
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated voltage regulator c...
- Patent number 11,916,006
- Issue date Feb 27, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit package supports
- Patent number 11,830,809
- Issue date Nov 28, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial magnetic inductors with pre-fabricated ferrite cores
- Patent number 11,735,535
- Issue date Aug 22, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-die partitioned voltage regulator
- Patent number 11,710,720
- Issue date Jul 25, 2023
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-in-via structure for high density package integrated inductor
- Patent number 11,676,950
- Issue date Jun 13, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated voltage regulator c...
- Patent number 11,462,463
- Issue date Oct 4, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having magnetic core inductors
- Patent number 11,450,560
- Issue date Sep 20, 2022
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to facilitate heat transfer within package layers to the...
- Patent number 11,437,294
- Issue date Sep 6, 2022
- Intel Corporation
- Sameer Shekhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer embedded magnetic inductor coil
- Patent number 11,404,364
- Issue date Aug 2, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,393,751
- Issue date Jul 19, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level distributed clamps
- Patent number 11,380,652
- Issue date Jul 5, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated inductor with composite magnetic resin layer
- Patent number 11,335,616
- Issue date May 17, 2022
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, device and system to protect circuitry during a burn-in pro...
- Patent number 11,215,662
- Issue date Jan 4, 2022
- Intel Corporation
- William Lambert
- G01 - MEASURING TESTING
Information Patent Grant
Reconfigurable inductor
- Patent number 11,211,866
- Issue date Dec 28, 2021
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-low profile package shielding technique using magnetic and co...
- Patent number 10,950,555
- Issue date Mar 16, 2021
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 10,748,842
- Issue date Aug 18, 2020
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic small footprint inductor array module for on-package volta...
- Patent number 10,741,536
- Issue date Aug 11, 2020
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to reduce power losses in an integrated voltag...
- Patent number 10,503,227
- Issue date Dec 10, 2019
- Intel Corporation
- Krishna Bharath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-voltage apparatus for electronics package including magnetic...
- Patent number 10,453,705
- Issue date Oct 22, 2019
- Intel Corporation
- Amit K. Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic small footprint inductor array module for on-package volta...
- Patent number 10,340,260
- Issue date Jul 2, 2019
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount inductor structures for forming one or more inductors...
- Patent number 10,056,182
- Issue date Aug 21, 2018
- Intel Corporation
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic small footprint inductor array module for on-package volta...
- Patent number 9,911,723
- Issue date Mar 6, 2018
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to reduce power losses in an integrated voltag...
- Patent number 9,753,510
- Issue date Sep 5, 2017
- Intel Corporation
- Krishna Bharath
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Suspended inductor microelectronic structures
- Patent number 9,526,175
- Issue date Dec 20, 2016
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations associated with a capductor assembly
- Patent number 9,230,944
- Issue date Jan 5, 2016
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
- Publication number 20240063183
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
- Publication number 20240063202
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN 3D POWER BLOCK
- Publication number 20230307441
- Publication date Sep 28, 2023
- Intel Corporation
- Ahmed ABOU-ALFOTOUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE RECESS IN MOTHERBOARD WITH THERMALLY CONDUCTIVE MOLD
- Publication number 20230189442
- Publication date Jun 15, 2023
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
- Publication number 20230096368
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...
- Publication number 20230095063
- Publication date Mar 30, 2023
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...
- Publication number 20230097714
- Publication date Mar 30, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-BUILT MAGNETIC INDUCTOR SCHEMES FOR GLASS CORE SUBSTRATES
- Publication number 20230089093
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230060727
- Publication date Mar 2, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230068300
- Publication date Mar 2, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED VOLTAGE REGULATOR C...
- Publication number 20220406701
- Publication date Dec 22, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE
- Publication number 20220310512
- Publication date Sep 29, 2022
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20220293327
- Publication date Sep 15, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR MAGNETIC RADIAL INDUCTORS TO ENABLE VR DISAGGREGATION
- Publication number 20220093537
- Publication date Mar 24, 2022
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE SWITCHING REGULATORS WITH HYBRID INDUCTORS AND PER PHAS...
- Publication number 20220094263
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TWO STAGE MULTI-INPUT MULTI-OUTPUT REGULATOR
- Publication number 20220094256
- Publication date Mar 24, 2022
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACKED DIE AND VR CHIPLET WITH DUAL-SIDED AND UNIDIRECTIONAL CURRE...
- Publication number 20220093565
- Publication date Mar 24, 2022
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS
- Publication number 20210327795
- Publication date Oct 21, 2021
- Intel Corporation
- ZHIGUO QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20210305154
- Publication date Sep 30, 2021
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY
- Publication number 20210183846
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL MAGNETIC INDUCTORS WITH PRE-FABRICATED FERRITE CORES
- Publication number 20210104475
- Publication date Apr 8, 2021
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED INDUCTOR
- Publication number 20210098326
- Publication date Apr 1, 2021
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-IN-VIA STRUCTURE FOR HIGH DENSITY PACKAGE INTEGRATED INDUCTOR
- Publication number 20210098436
- Publication date Apr 1, 2021
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE INDUCTOR
- Publication number 20210036618
- Publication date Feb 4, 2021
- Intel Corporation
- WILLIAM J. Lambert
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS
- Publication number 20200373232
- Publication date Nov 26, 2020
- Intel Corporation
- ZHIGUO QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL DISTRIBUTED CLAMPS
- Publication number 20200251448
- Publication date Aug 6, 2020
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED VOLTAGE REGULATOR C...
- Publication number 20200105653
- Publication date Apr 2, 2020
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING MAGNETIC CORE INDUCTORS
- Publication number 20200098621
- Publication date Mar 26, 2020
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS

Kaladhar Radhakrishnan

Person

Patents Grantslast 30 patents

Two stage multi-input multi-output regulator

Multi-phase switching regulators with hybrid inductors and per phas...

Package-integrated multi-turn coil embedded in a package magnetic core

Microelectronic assemblies having an integrated voltage regulator c...

Magnetic structures in integrated circuit package supports

Coaxial magnetic inductors with pre-fabricated ferrite cores

Integrated multi-die partitioned voltage regulator

Package substrates with magnetic build-up layers

Via-in-via structure for high density package integrated inductor

Microelectronic assemblies having an integrated voltage regulator c...

Microelectronic assemblies having magnetic core inductors

Structures to facilitate heat transfer within package layers to the...

Multi-layer embedded magnetic inductor coil

Package-integrated multi-turn coil embedded in a package magnetic core

Multi-level distributed clamps

Substrate integrated inductor with composite magnetic resin layer

Method, device and system to protect circuitry during a burn-in pro...

Reconfigurable inductor

Package substrates with magnetic build-up layers

Ultra-low profile package shielding technique using magnetic and co...

Package substrates with magnetic build-up layers

Magnetic small footprint inductor array module for on-package volta...

Apparatus and method to reduce power losses in an integrated voltag...

Multi-voltage apparatus for electronics package including magnetic...

Magnetic small footprint inductor array module for on-package volta...

Surface-mount inductor structures for forming one or more inductors...

Magnetic small footprint inductor array module for on-package volta...

Apparatus and method to reduce power losses in an integrated voltag...

Suspended inductor microelectronic structures

Techniques and configurations associated with a capductor assembly

Patents Applicationslast 30 patents

MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...

PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...

METAL PCB FOR TOPSIDE POWER DELIVERY

GAN 3D POWER BLOCK

BACKSIDE RECESS IN MOTHERBOARD WITH THERMALLY CONDUCTIVE MOLD

IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES

INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...

IN-BUILT MAGNETIC INDUCTOR SCHEMES FOR GLASS CORE SUBSTRATES

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED VOLTAGE REGULATOR C...

PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE

CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

PLANAR MAGNETIC RADIAL INDUCTORS TO ENABLE VR DISAGGREGATION

MULTI-PHASE SWITCHING REGULATORS WITH HYBRID INDUCTORS AND PER PHAS...

TWO STAGE MULTI-INPUT MULTI-OUTPUT REGULATOR

STACKED DIE AND VR CHIPLET WITH DUAL-SIDED AND UNIDIRECTIONAL CURRE...

PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS

MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS

ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY

COAXIAL MAGNETIC INDUCTORS WITH PRE-FABRICATED FERRITE CORES

SUBSTRATE INTEGRATED INDUCTOR

VIA-IN-VIA STRUCTURE FOR HIGH DENSITY PACKAGE INTEGRATED INDUCTOR

RECONFIGURABLE INDUCTOR

PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS

MULTI-LEVEL DISTRIBUTED CLAMPS

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED VOLTAGE REGULATOR C...

MICROELECTRONIC ASSEMBLIES HAVING MAGNETIC CORE INDUCTORS