Kam Fai Lee

Follow

Person

Tin Shui Wai, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Land grid array packaged device and method of forming same
- Patent number 7,205,178
- Issue date Apr 17, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging an optical sensor
- Patent number 6,905,910
- Issue date Jun 14, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Land grid array packaged device and method of forming same
- Publication number 20050214980
- Publication date Sep 29, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging an optical sensor
- Publication number 20050156301
- Publication date Jul 21, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING AN OPTICAL SENSOR
- Publication number 20050146001
- Publication date Jul 7, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS