Kamalesh K. Srivistava

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Wappinger Falls, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Creation of lead-free solder joint with intermetallics
- Patent number 8,268,716
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS