Kamran Manteghi

Person

Manteca, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density leaded ball-grid array package
- Patent number 6,228,683
- Issue date May 8, 2001
- Philips Electronics North America Corp.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiO2 wire bond insulation in semiconductor assemblies
- Patent number 6,177,726
- Issue date Jan 23, 2001
- Philips Electronics North America Corporation
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded lead frame ball grid array
- Patent number 6,083,776
- Issue date Jul 4, 2000
- Philips Electronics North America Corporation
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide wire bond insulation in semiconductor assemblies
- Patent number 6,046,075
- Issue date Apr 4, 2000
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide wire bond insulation in semiconductor assemblies
- Patent number 6,040,633
- Issue date Mar 21, 2000
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies
- Patent number 6,033,937
- Issue date Mar 7, 2000
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a multi layer bumped semiconductor device
- Patent number 5,863,812
- Issue date Jan 26, 1999
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density leaded ball-grid array package
- Patent number 5,854,512
- Issue date Dec 29, 1998
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe ball grid array
- Patent number 5,847,455
- Issue date Dec 8, 1998
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically enhanced power quad flat pack arrangement
- Patent number 5,800,958
- Issue date Sep 1, 1998
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to produce cavity-up HBGA packages
- Patent number 5,796,038
- Issue date Aug 18, 1998
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe ball grid array package
- Patent number 5,710,695
- Issue date Jan 20, 1998
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrate structure
- Patent number 5,689,091
- Issue date Nov 18, 1997
- VLSI Technology, Inc.
- Ahmad Hamzehdoost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for improving bonding strength of leadframe to substrate...
- Patent number 5,661,337
- Issue date Aug 26, 1997
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically enhanced power quad flat pack arrangement
- Patent number 5,646,831
- Issue date Jul 8, 1997
- VLSI Technology, Inc.
- Kamran Manteghi
- H01 - BASIC ELECTRIC ELEMENTS

Kamran Manteghi

Person

Patents Grantslast 30 patents

High density leaded ball-grid array package

SiO2 wire bond insulation in semiconductor assemblies

Molded lead frame ball grid array

Oxide wire bond insulation in semiconductor assemblies

Oxide wire bond insulation in semiconductor assemblies

S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies

Process for manufacturing a multi layer bumped semiconductor device

High density leaded ball-grid array package

Molded leadframe ball grid array

Electrically enhanced power quad flat pack arrangement

Technique to produce cavity-up HBGA packages

Leadframe ball grid array package

Multi-layer substrate structure

Technique for improving bonding strength of leadframe to substrate...

Electrically enhanced power quad flat pack arrangement