Kan-Ju LIN

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,002,867
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor device structure with metal-semic...
- Patent number 11,222,818
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiang Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with low resistivity contact structure
- Patent number 11,011,611
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with low resistivity contact structure and met...
- Patent number 10,700,177
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240404876
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20240379423
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE RELATED TO SEAMLESS METAL CONTACT
- Publication number 20240313075
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240274687
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-Free Conductive Contact Formation
- Publication number 20240021687
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230411457
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Hsuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411496
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE
- Publication number 20230411242
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230395429
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230253308
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION
- Publication number 20230137108
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20230068965
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230036693
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20230008239
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220376111
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20220367194
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Hsuan LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH LOW RESISTIVITY CONTACT STRUCTURE
- Publication number 20200335597
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH METAL-SEMIC...
- Publication number 20200020583
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiang CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LOW RESISTIVITY CONTACT STRUCTURE AND MET...
- Publication number 20190097012
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu HUNG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Contact structure for semiconductor device

Formation method of semiconductor device structure with metal-semic...

Semiconductor device with low resistivity contact structure

Semiconductor device with low resistivity contact structure and met...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

METHOD AND DEVICE RELATED TO SEAMLESS METAL CONTACT

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

Void-Free Conductive Contact Formation

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE

CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

Semiconductor Devices and Methods of Manufacture

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

SEMICONDUCTOR DEVICE WITH LOW RESISTIVITY CONTACT STRUCTURE

FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH METAL-SEMIC...

SEMICONDUCTOR DEVICE WITH LOW RESISTIVITY CONTACT STRUCTURE AND MET...