Kan Wae LAM

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level semiconductor device with wettable flanks
- Patent number 10,410,941
- Issue date Sep 10, 2019
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of making same
- Patent number 10,304,759
- Issue date May 28, 2019
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible semiconductor die
- Patent number 10,262,926
- Issue date Apr 16, 2019
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefor
- Patent number 10,256,168
- Issue date Apr 9, 2019
- Nexperia B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wettable corner leads
- Patent number 9,847,283
- Issue date Dec 19, 2017
- Nexperia B.V.
- Xue Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-up lead frame package and method of making thereof
- Patent number 9,640,463
- Issue date May 2, 2017
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-up lead frame QFN and DFN packages and method of making thereof
- Patent number 9,391,007
- Issue date Jul 12, 2016
- NXP B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REVERSIBLE SEMICONDUCTOR DIE
- Publication number 20180096916
- Publication date Apr 5, 2018
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SEMICONDUCTOR DEVICE WITH WETTABLE FLANKS
- Publication number 20180068920
- Publication date Mar 8, 2018
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR
- Publication number 20170358514
- Publication date Dec 14, 2017
- Nexperia B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20170170103
- Publication date Jun 15, 2017
- Nexperia B.V.
- SHUN TIK YEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MAKING SAME
- Publication number 20170053855
- Publication date Feb 23, 2017
- NXP B.V.
- KAN WAE LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILT-UP LEAD FRAME PACKAGE AND METHOD OF MAKING THEREOF
- Publication number 20160372403
- Publication date Dec 22, 2016
- NXP B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS