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Singapore, SG
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device and method of forming stacked vias within inte...
Patent number
9,385,009
Issue date
Jul 5, 2016
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor Device and Method of Forming Interconnect Substration...
Publication number
20130075936
Publication date
Mar 28, 2013
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS