TREA

Kang Chin Wei

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  • Tainan City, TW
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Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-LAYER STRUCTURES AND METHODS OF FORMING
    • Publication number 20200176254
    • Publication date Jun 4, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chang-Jung Hsueh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Metal Bumps and Method Forming Same
    • Publication number 20200105696
    • Publication date Apr 2, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Da Cheng
    • H01 - BASIC ELECTRIC ELEMENTS