Kang Rim Choi

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Discrete power transistor package having solderless DBC to leadfram...
- Patent number 11,387,162
- Issue date Jul 12, 2022
- Littelfuse, Inc.
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead and lead frame for power package
- Patent number 10,763,201
- Issue date Sep 1, 2020
- Littelfuse, Inc.
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete power transistor package having solderless DBC to leadfram...
- Patent number 10,720,376
- Issue date Jul 21, 2020
- Littelfuse, Inc.
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead and lead frame for power package
- Patent number 9,842,795
- Issue date Dec 12, 2017
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power semiconductor package with optimized la...
- Patent number 9,177,888
- Issue date Nov 3, 2015
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power semiconductor package with optimized la...
- Patent number 8,901,723
- Issue date Dec 2, 2014
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead and lead frame for power package
- Patent number 8,796,837
- Issue date Aug 5, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power semiconductor package with optimized la...
- Patent number 8,455,987
- Issue date Jun 4, 2013
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Induction heating circuit and winding method for heating coils
- Patent number 7,459,659
- Issue date Dec 2, 2008
- IXYS Corporation
- Kyoung Wook Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided cooling isolated packaged power semiconductor device
- Patent number 7,005,734
- Issue date Feb 28, 2006
- IXYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency power device with a plastic molded package and direc...
- Patent number 6,731,002
- Issue date May 4, 2004
- IXYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device with a plastic molded package and direct bonded substrate
- Patent number 6,727,585
- Issue date Apr 27, 2004
- IXYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power semiconductor package
- Patent number 6,710,463
- Issue date Mar 23, 2004
- IXYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power device package
- Patent number 6,583,505
- Issue date Jun 24, 2003
- IXYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrically isolated power semiconductor package
- Patent number 6,534,343
- Issue date Mar 18, 2003
- IXYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power semiconductor package
- Patent number 6,404,065
- Issue date Jun 11, 2002
- I-XYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...
- Publication number 20200303281
- Publication date Sep 24, 2020
- IXYS, LLC
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...
- Publication number 20190088571
- Publication date Mar 21, 2019
- IXYS, LLC
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead And Lead Frame For Power Package
- Publication number 20180096918
- Publication date Apr 5, 2018
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete Power Transistor Package Having Solderless DBC To Leadfram...
- Publication number 20170178998
- Publication date Jun 22, 2017
- IXYS Corporation
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE WITH OPTIMIZED LA...
- Publication number 20150087113
- Publication date Mar 26, 2015
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead And Lead Frame For Power Package
- Publication number 20140312477
- Publication date Oct 23, 2014
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Isolated Power Semiconductor Package With Optimized La...
- Publication number 20130252381
- Publication date Sep 26, 2013
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...
- Publication number 20130175704
- Publication date Jul 11, 2013
- IXYS Corporation
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD AND LEAD FRAME FOR POWER PACKAGE
- Publication number 20100224982
- Publication date Sep 9, 2010
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTION HEATING CIRCUIT AND WINDING METHOD FOR HEATING COILS
- Publication number 20070246458
- Publication date Oct 25, 2007
- IXYS CORPORATION
- Kyoung Wook SEOK
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Double-sided cooling isolated packaged power semiconductor device
- Publication number 20040222515
- Publication date Nov 11, 2004
- IXYS CORPORATION
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically isolated power device package
- Publication number 20030186483
- Publication date Oct 2, 2003
- IXYS CORPORATION
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically isolated power device package
- Publication number 20020171134
- Publication date Nov 21, 2002
- IXYS CORPORATION
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency power device with a plastic molded package and direc...
- Publication number 20020163070
- Publication date Nov 7, 2002
- IXYS CORPORATION
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power device with a plastic molded package and direct bonded substrate
- Publication number 20020163074
- Publication date Nov 7, 2002
- IXYS CORPORATION
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically isolated power semiconductor package
- Publication number 20020017714
- Publication date Feb 14, 2002
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically isolated power semiconductor package
- Publication number 20010018235
- Publication date Aug 30, 2001
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS

Kang Rim Choi

Person

Patents Grantslast 30 patents

Discrete power transistor package having solderless DBC to leadfram...

Lead and lead frame for power package

Discrete power transistor package having solderless DBC to leadfram...

Lead and lead frame for power package

Electrically isolated power semiconductor package with optimized la...

Electrically isolated power semiconductor package with optimized la...

Lead and lead frame for power package

Electrically isolated power semiconductor package with optimized la...

Induction heating circuit and winding method for heating coils

Double-sided cooling isolated packaged power semiconductor device

High frequency power device with a plastic molded package and direc...

Power device with a plastic molded package and direct bonded substrate

Electrically isolated power semiconductor package

Electrically isolated power device package

Method of making electrically isolated power semiconductor package

Electrically isolated power semiconductor package

Patents Applicationslast 30 patents

DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...

DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...

Lead And Lead Frame For Power Package

Discrete Power Transistor Package Having Solderless DBC To Leadfram...

ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE WITH OPTIMIZED LA...

Lead And Lead Frame For Power Package

Electrically Isolated Power Semiconductor Package With Optimized La...

DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...

LEAD AND LEAD FRAME FOR POWER PACKAGE

INDUCTION HEATING CIRCUIT AND WINDING METHOD FOR HEATING COILS

Double-sided cooling isolated packaged power semiconductor device

Electrically isolated power device package

Electrically isolated power device package

High frequency power device with a plastic molded package and direc...

Power device with a plastic molded package and direct bonded substrate

Electrically isolated power semiconductor package

Electrically isolated power semiconductor package