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Kang Wook BONG

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    COIL COMPONENT
    • Publication number 20250037914
    • Publication date Jan 30, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Young KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TANTALUM CAPACITOR
    • Publication number 20250014841
    • Publication date Jan 9, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Boum Seock Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20230178291
    • Publication date Jun 8, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Do Young JUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220208433
    • Publication date Jun 30, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook Bong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220172878
    • Publication date Jun 2, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Do Young Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING SAME
    • Publication number 20190378644
    • Publication date Dec 12, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL ELECTRONIC COMPONENT
    • Publication number 20190362886
    • Publication date Nov 28, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20190326055
    • Publication date Oct 24, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR
    • Publication number 20190259522
    • Publication date Aug 22, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Hun KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND MANUFACTURING METHOD THEREOF
    • Publication number 20190221356
    • Publication date Jul 18, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INDUCTOR
    • Publication number 20190198234
    • Publication date Jun 27, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Ji Hyung JUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20190180905
    • Publication date Jun 13, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Joung Gul RYU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN FILM-TYPE INDUCTOR
    • Publication number 20190013142
    • Publication date Jan 10, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Boum Seock KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN FILM TYPE INDUCTOR
    • Publication number 20190013143
    • Publication date Jan 10, 2019
    • Boum Seock KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20190006100
    • Publication date Jan 3, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20180358171
    • Publication date Dec 13, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Ji Hyung JUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20180350505
    • Publication date Dec 6, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Joung Gul RYU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20180197672
    • Publication date Jul 12, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Boum Seock KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING SAME
    • Publication number 20180019051
    • Publication date Jan 18, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20160192490
    • Publication date Jun 30, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Myung-Sam KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20160192491
    • Publication date Jun 30, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Myung-Sam KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20160100485
    • Publication date Apr 7, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Hye-Won JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME AND STACK TYPE PACK...
    • Publication number 20160021749
    • Publication date Jan 21, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE...
    • Publication number 20150342046
    • Publication date Nov 26, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Hye Jin KIM
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20150156883
    • Publication date Jun 4, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook Bong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUC...
    • Publication number 20150156882
    • Publication date Jun 4, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Kang Wook BONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INSULATION MATERIAL, PRINTED CIRCUIT BOARD USING THE SAME AND METHO...
    • Publication number 20150114699
    • Publication date Apr 30, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Gwan Ko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE
    • Publication number 20110299264
    • Publication date Dec 8, 2011
    • Samsung Electro-Mechanics CO., LTD.
    • Han Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed circuit board having electromagnetic bandgap structure
    • Publication number 20110067914
    • Publication date Mar 24, 2011
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyo-Jic Jung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed circuit board having electromagnetic bandgap structure
    • Publication number 20110067917
    • Publication date Mar 24, 2011
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae-Hyun Park
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR