Kang Wook BONG

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Coil component
- Patent number 12,057,253
- Issue date Aug 6, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing the same
- Patent number 11,501,915
- Issue date Nov 15, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and manufacturing method thereof
- Patent number 11,217,380
- Issue date Jan 4, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 11,205,539
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Hyung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor and method for manufacturing the same
- Patent number 11,145,452
- Issue date Oct 12, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Boum Seock Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component
- Patent number 11,139,108
- Issue date Oct 5, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method for manufacturing the same
- Patent number 11,094,458
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor
- Patent number 10,861,633
- Issue date Dec 8, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 10,796,840
- Issue date Oct 6, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Joung Gul Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film-type inductor
- Patent number 10,763,032
- Issue date Sep 1, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Boum Seock Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film type inductor
- Patent number 10,741,321
- Issue date Aug 11, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Boum Seock Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing same
- Patent number 10,566,130
- Issue date Feb 18, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing same
- Patent number 10,515,754
- Issue date Dec 24, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,021,785
- Issue date Jul 10, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung-Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,554,466
- Issue date Jan 24, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung-Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMI noise shield board including electromagnetic bandgap structure
- Patent number 8,699,234
- Issue date Apr 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic bandgap structure and printed circuit board
- Patent number 8,319,572
- Issue date Nov 27, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having electromagnetic bandgap structure
- Patent number 8,314,341
- Issue date Nov 20, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference noise reduction board using electromag...
- Patent number 8,258,408
- Issue date Sep 4, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having electromagnetic bandgap structure
- Patent number 8,242,377
- Issue date Aug 14, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Hyo-Jic Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having electromagnetic bandgap structure
- Patent number 8,227,704
- Issue date Jul 24, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Dae-Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference noise reduction board using electromag...
- Patent number 8,212,150
- Issue date Jul 3, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic bandgap structure and printed circuit board
- Patent number 8,076,998
- Issue date Dec 13, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Kang-Wook Bong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COIL COMPONENT
- Publication number 20230178291
- Publication date Jun 8, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Do Young JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20220208433
- Publication date Jun 30, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20220172878
- Publication date Jun 2, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Do Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING SAME
- Publication number 20190378644
- Publication date Dec 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL ELECTRONIC COMPONENT
- Publication number 20190362886
- Publication date Nov 28, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190326055
- Publication date Oct 24, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR
- Publication number 20190259522
- Publication date Aug 22, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20190221356
- Publication date Jul 18, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR
- Publication number 20190198234
- Publication date Jun 27, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20190180905
- Publication date Jun 13, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Joung Gul RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM-TYPE INDUCTOR
- Publication number 20190013142
- Publication date Jan 10, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Boum Seock KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TYPE INDUCTOR
- Publication number 20190013143
- Publication date Jan 10, 2019
- Boum Seock KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190006100
- Publication date Jan 3, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20180358171
- Publication date Dec 13, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180350505
- Publication date Dec 6, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Joung Gul RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180197672
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Boum Seock KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING SAME
- Publication number 20180019051
- Publication date Jan 18, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160192490
- Publication date Jun 30, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160192491
- Publication date Jun 30, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160100485
- Publication date Apr 7, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Hye-Won JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME AND STACK TYPE PACK...
- Publication number 20160021749
- Publication date Jan 21, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE...
- Publication number 20150342046
- Publication date Nov 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Hye Jin KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150156883
- Publication date Jun 4, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook Bong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUC...
- Publication number 20150156882
- Publication date Jun 4, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kang Wook BONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION MATERIAL, PRINTED CIRCUIT BOARD USING THE SAME AND METHO...
- Publication number 20150114699
- Publication date Apr 30, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Young Gwan Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE
- Publication number 20110299264
- Publication date Dec 8, 2011
- Samsung Electro-Mechanics CO., LTD.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having electromagnetic bandgap structure
- Publication number 20110067914
- Publication date Mar 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hyo-Jic Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having electromagnetic bandgap structure
- Publication number 20110067917
- Publication date Mar 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Dae-Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetic interference noise reduction board using electromag...
- Publication number 20110069470
- Publication date Mar 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Kang-Wook Bong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetic interference noise reduction board using electromag...
- Publication number 20110067915
- Publication date Mar 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kang Wook BONG

Person

Patents Grantslast 30 patents

Coil component

Coil component and method of manufacturing the same

Coil component and manufacturing method thereof

Coil component

Inductor and method for manufacturing the same

Coil electronic component

Coil component and method for manufacturing the same

Inductor

Coil component

Thin film-type inductor

Thin film type inductor

Coil component and method of manufacturing same

Coil component and method of manufacturing same

Printed circuit board and method of manufacturing the same

Printed circuit board and method of manufacturing the same

EMI noise shield board including electromagnetic bandgap structure

Electromagnetic bandgap structure and printed circuit board

Printed circuit board having electromagnetic bandgap structure

Electromagnetic interference noise reduction board using electromag...

Printed circuit board having electromagnetic bandgap structure

Printed circuit board having electromagnetic bandgap structure

Electromagnetic interference noise reduction board using electromag...

Electromagnetic bandgap structure and printed circuit board

Patents Applicationslast 30 patents

COIL COMPONENT

COIL COMPONENT

COIL COMPONENT

COIL COMPONENT AND METHOD OF MANUFACTURING SAME

COIL ELECTRONIC COMPONENT

COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

INDUCTOR

COIL COMPONENT AND MANUFACTURING METHOD THEREOF

INDUCTOR

COIL COMPONENT

THIN FILM-TYPE INDUCTOR

THIN FILM TYPE INDUCTOR

COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

COIL COMPONENT

COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

INDUCTOR AND METHOD FOR MANUFACTURING THE SAME

COIL COMPONENT AND METHOD OF MANUFACTURING SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME AND STACK TYPE PACK...

PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUC...

INSULATION MATERIAL, PRINTED CIRCUIT BOARD USING THE SAME AND METHO...

EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE

Printed circuit board having electromagnetic bandgap structure

Printed circuit board having electromagnetic bandgap structure

Electromagnetic interference noise reduction board using electromag...

Electromagnetic interference noise reduction board using electromag...