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Kang Yang
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St. Paul, MN, US
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Patents Grants
last 30 patents
Information
Patent Grant
Techniques for indicating beam switching capability
Patent number
12,022,442
Issue date
Jun 25, 2024
QUALCOMM Incorporated
Vasanthan Raghavan
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Optimized component carrier activation and deactivation
Patent number
11,902,951
Issue date
Feb 13, 2024
QUALCOMM Incorporated
Yongle Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Parallel electrical connection structure for battery poles, a paral...
Patent number
11,862,818
Issue date
Jan 2, 2024
JIAXING MODU NEW ENERGY CO., LTD
Bo Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for enabling power savings with phase shifter configurat...
Patent number
11,849,397
Issue date
Dec 19, 2023
QUALCOMM Incorporated
Vasanthan Raghavan
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Techniques for indicating beam switching capability
Patent number
11,540,273
Issue date
Dec 27, 2022
QUALCOMM Incorporated
Vasanthan Raghavan
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Multimode transceiving
Patent number
11,177,849
Issue date
Nov 16, 2021
QUALCOMM Incorporated
Chuan Wang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Interlayer dielectric and pre-applied die attach adhesive materials
Patent number
7,550,825
Issue date
Jun 23, 2009
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Interlayer dielectric and pre-applied die attach adhesive materials
Patent number
7,312,534
Issue date
Dec 25, 2007
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Conductive ink compositions
Patent number
7,037,447
Issue date
May 2, 2006
Henkel Corporation
Kang Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low shrinkage thermosetting resin compositions and methods of use t...
Patent number
6,963,001
Issue date
Nov 8, 2005
Henkel Corporation
Stephen M. Dershem
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Film adhesives containing maleimide compounds and methods for use t...
Patent number
6,831,132
Issue date
Dec 14, 2004
Henkel Corporation
Puwei Liu
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Low shrinkage thermosetting resin compositions and methods of use t...
Patent number
6,620,946
Issue date
Sep 16, 2003
Loctite Corporation
Stephen M. Dershem
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Bookbinding case-making applications utilizing polyurethanes
Patent number
6,479,126
Issue date
Nov 12, 2002
H. B. Fuller Licensing & Financing Inc.
Kang Yang
B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information
Patent Grant
Bookbinding applications utilizing warm melt polyurethanes
Patent number
6,207,248
Issue date
Mar 27, 2001
H.B. Fuller Licensing & Financing, Inc.
Kang Yang
B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information
Patent Grant
Catalyzed reactive hot melts
Patent number
6,020,429
Issue date
Feb 1, 2000
H.B. Fuller Licensing & Financing, Inc.
Kang Yang
B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Patents Applications
last 30 patents
Information
Patent Application
PHASED ARRAY ANTENNA ARCHITECTURE
Publication number
20240204806
Publication date
Jun 20, 2024
QUALCOMM Incorporated
Yunfei FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR MANAGING LOW OR VARIABLE PHASE SHIFT RESOLUTIONS IN...
Publication number
20240097749
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Vasanthan Raghavan
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PARALLEL ELECTRICAL CONNECTION STRUCTURE FOR BATTERY POLES, A PARAL...
Publication number
20230318149
Publication date
Oct 5, 2023
JIAXING MODU NEW ENERGY CO., LTD
Bo WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR INDICATING BEAM SWITCHING CAPABILITY
Publication number
20230247592
Publication date
Aug 3, 2023
QUALCOMM Incorporated
Vasanthan Raghavan
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
OPTIMIZED COMPONENT CARRIER ACTIVATION AND DEACTIVATION
Publication number
20230093843
Publication date
Mar 30, 2023
QUALCOMM Incorporated
Yongle WU
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
TECHNIQUES FOR ENABLING POWER SAVINGS WITH PHASE SHIFTER CONFIGURAT...
Publication number
20230047558
Publication date
Feb 16, 2023
QUALCOMM Incorporated
Vasanthan Raghavan
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
TECHNIQUES FOR INDICATING BEAM SWITCHING CAPABILITY
Publication number
20220322317
Publication date
Oct 6, 2022
QUALCOMM Incorporated
Vasanthan Raghavan
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Multimode Transceiving
Publication number
20210099197
Publication date
Apr 1, 2021
QUALCOMM Incorporated
Chuan Wang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
CROSSLINKED POLYMERIC MATERIALS AS FILLER AND SPACERS IN ADHESIVES
Publication number
20090050266
Publication date
Feb 26, 2009
Kang Yang
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials
Publication number
20070278683
Publication date
Dec 6, 2007
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Co-curable compositions
Publication number
20050288457
Publication date
Dec 29, 2005
Puwei Liu
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Film adhesives containing maleimide compounds and methods for use t...
Publication number
20050107542
Publication date
May 19, 2005
Henkel Corporation
Puwei Liu
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Interlayer dielectric and pre-applied die attach adhesive materials
Publication number
20050008832
Publication date
Jan 13, 2005
Benedicto de los Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Low shrinkage thermosetting resin compositions and methods of use t...
Publication number
20040019224
Publication date
Jan 29, 2004
HENKEL LOCTITE CORPORATION
Stephen M. Dershem
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Film adhesives containing maleimide compounds and methods for use t...
Publication number
20030199638
Publication date
Oct 23, 2003
Puwei Liu
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Low shrinkage thermosetting resin compositions and methods of use t...
Publication number
20020188137
Publication date
Dec 12, 2002
Loctite Corporation
Stephen M. Dershem
C07 - ORGANIC CHEMISTRY