Kang-Yi Lien

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bond wave optimization method and device
- Patent number 12,162,749
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond wave optimization method and device
- Patent number 11,834,332
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240395897
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DETECTING SEMICONDUCTOR DEVICE
- Publication number 20240038597
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FAN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Wave Optimization Method and Device
- Publication number 20230382723
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230282726
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED DIELECTRIC FILM STRUCTURE AND ME...
- Publication number 20230278073
- Publication date Sep 7, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
BOND WAVE OPTIMIZATION METHOD AND DEVICE
- Publication number 20230043571
- Publication date Feb 9, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230036136
- Publication date Feb 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kang-Yi Lien

Person

Patents Grantslast 30 patents

Bond wave optimization method and device

Bond wave optimization method and device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

THICK REDISTRIBUTION LAYER FEATURES

METHOD AND SYSTEM FOR DETECTING SEMICONDUCTOR DEVICE

Bond Wave Optimization Method and Device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH IMPROVED DIELECTRIC FILM STRUCTURE AND ME...

BOND WAVE OPTIMIZATION METHOD AND DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME