Kangsheng QIU

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method, apparatus, and system for wafer grounding
- Patent number 12,051,562
- Issue date Jul 30, 2024
- ASML Netherlands B.V.
- Yixiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING
- Publication number 20240371599
- Publication date Nov 7, 2024
- ASML Netheriands B. V.
- Yixiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING
- Publication number 20220277926
- Publication date Sep 1, 2022
- ASML NETHERLANDS B.V.
- Yixiang WANG
- H01 - BASIC ELECTRIC ELEMENTS