Kanji Murakami

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroless gold plating solution and method for electroless plating
- Patent number 6,811,828
- Issue date Nov 2, 2004
- Hitachi Chemical Co., Ltd.
- Akio Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing multiple wire wiring board
- Patent number 5,584,121
- Issue date Dec 17, 1996
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multiple wire adhesive on a multiple wire wiring board
- Patent number 5,486,655
- Issue date Jan 23, 1996
- Hitachi Chemical Co., Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...
- Patent number 5,403,869
- Issue date Apr 4, 1995
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for improving adhesion of a resist layer to a metallic layer...
- Patent number 5,139,923
- Issue date Aug 18, 1992
- Hitachi, Ltd.
- Ritsuji Toba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed circuit board
- Patent number 5,028,513
- Issue date Jul 2, 1991
- Hitachi, Ltd.
- Kanji Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite article comprising a copper element and a process for pro...
- Patent number 4,970,107
- Issue date Nov 13, 1990
- Hitachi, Ltd.
- Haruo Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed circuit board
- Patent number 4,876,177
- Issue date Oct 24, 1989
- Hitachi, Ltd.
- Haruo Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for electroless copper plating and apparatus used therefor
- Patent number 4,865,888
- Issue date Sep 12, 1989
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photo-curable resist resin composition for electroless plating, pro...
- Patent number 4,820,549
- Issue date Apr 11, 1989
- Hitachi, Ltd.
- Kiyoshi Ozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of bonding copper and resin
- Patent number 4,642,161
- Issue date Feb 10, 1987
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless copper plating
- Patent number 4,632,852
- Issue date Dec 30, 1986
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board, process for preparing the same and resist in...
- Patent number 4,610,910
- Issue date Sep 9, 1986
- Hitachi, Ltd.
- Mineo Kawamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacture of printed wiring board
- Patent number 4,604,160
- Issue date Aug 5, 1986
- Hitachi, Ltd.
- Kanji Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing printed circuit boards
- Patent number 4,457,952
- Issue date Jul 3, 1984
- Hitachi, Ltd.
- Mineo Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed circuit board by electroless plating
- Patent number 4,378,384
- Issue date Mar 29, 1983
- Hitachi, Ltd.
- Kanji Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing copper barrier type, nuclear fuel cladding
- Patent number 4,343,659
- Issue date Aug 10, 1982
- Hitachi, Ltd.
- Kanji Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for forming printed wiring by electroless deposition
- Patent number 4,239,813
- Issue date Dec 16, 1980
- Hitachi, Ltd.
- Kanji Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for production of printed circuits by electroless metal plat...
- Patent number 4,151,313
- Issue date Apr 24, 1979
- Hitachi, Ltd.
- Motoyo Wajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper solution
- Patent number 4,099,974
- Issue date Jul 11, 1978
- Hitachi, Ltd.
- Hirosada Morishita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Electroless gold plating solution and method for electroless plating
- Publication number 20040028833
- Publication date Feb 12, 2004
- Akio Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kanji Murakami

Person

Patents Grantslast 30 patents

Electroless gold plating solution and method for electroless plating

Process for producing multiple wire wiring board

Multiple wire adhesive on a multiple wire wiring board

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...

Method for improving adhesion of a resist layer to a metallic layer...

Process for producing printed circuit board

Composite article comprising a copper element and a process for pro...

Process for producing printed circuit board

Process for electroless copper plating and apparatus used therefor

Photo-curable resist resin composition for electroless plating, pro...

Method of bonding copper and resin

Process for electroless copper plating

Printed circuit board, process for preparing the same and resist in...

Method for manufacture of printed wiring board

Process for producing printed circuit boards

Process for producing printed circuit board by electroless plating

Process for producing copper barrier type, nuclear fuel cladding

Process for forming printed wiring by electroless deposition

Method for production of printed circuits by electroless metal plat...

Electroless copper solution

Patents Applicationslast 30 patents

Electroless gold plating solution and method for electroless plating