Kanta DEI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Layered bonding material, semiconductor package, and power module
- Patent number 12,080,671
- Issue date Sep 3, 2024
- Senju Metal Industry Co., Ltd.
- Naoto Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 12,053,843
- Issue date Aug 6, 2024
- Senju Metal Industry Co., Ltd.
- Shunsaku Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 11,633,815
- Issue date Apr 25, 2023
- Senju Metal Industry Co., Ltd.
- Toru Hayashida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, cast article, formed article, and solder joint
- Patent number 11,607,753
- Issue date Mar 21, 2023
- Senju Metal Industry Co., Ltd.
- Shunsaku Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240342838
- Publication date Oct 17, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Shunsaku YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE
- Publication number 20240213206
- Publication date Jun 27, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Naoto KAMEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT
- Publication number 20230398643
- Publication date Dec 14, 2023
- SENJU METAL INDUSTRY CO., LTD
- Yuki IIJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, and Solder Joint
- Publication number 20230129147
- Publication date Apr 27, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Yuuki Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...
- Publication number 20230068294
- Publication date Mar 2, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Yuuki IIJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...
- Publication number 20230060857
- Publication date Mar 2, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Yuuki IIJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...
- Publication number 20220355420
- Publication date Nov 10, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Shunsaku YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Ar...
- Publication number 20220324061
- Publication date Oct 13, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Yuuki Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, CAST ARTICLE, FORMED ARTICLE, AND SOLDER JOINT
- Publication number 20220143761
- Publication date May 12, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Shunsaku YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20210114143
- Publication date Apr 22, 2021
- SENJU METAL INDUSTRY CO., LTD
- Toru HAYASHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AN...
- Publication number 20210001431
- Publication date Jan 7, 2021
- SENJU METAL INDUSTRY CO., LTD
- Takahiro YOKOYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Layered bonding material, semiconductor package, and power module

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Solder paste

Solder alloy, cast article, formed article, and solder joint

Patents Applicationslast 30 patents

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE

SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT

Solder Alloy, Solder Ball, and Solder Joint

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Ar...

SOLDER ALLOY, CAST ARTICLE, FORMED ARTICLE, AND SOLDER JOINT

SOLDER PASTE

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AN...