Kanwal Jit Singh

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatuses to form self-aligned caps
- Patent number 10,727,183
- Issue date Jul 28, 2020
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doric pillar supported maskless airgap structure for capacitance be...
- Patent number 10,593,627
- Issue date Mar 17, 2020
- Intel Corporation
- Kanwal Jit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses to form self-aligned caps
- Patent number 10,446,493
- Issue date Oct 15, 2019
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via self alignment and shorting improvement with airgap integration...
- Patent number 10,147,639
- Issue date Dec 4, 2018
- Intel Corporation
- Kanwal Jit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to contact tight pitch conductive layers with...
- Patent number 10,032,643
- Issue date Jul 24, 2018
- Intel Corporation
- Jasmeet S. Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming interconnects in porous dielectric materials
- Patent number 9,887,161
- Issue date Feb 6, 2018
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures
- Patent number 9,754,886
- Issue date Sep 5, 2017
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming barrier walls, capping, or alloys /compounds within metal l...
- Patent number 9,659,869
- Issue date May 23, 2017
- Intel Corporation
- Christopher J Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses to form self-aligned caps
- Patent number 9,627,321
- Issue date Apr 18, 2017
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of DRAM capacitor among metal interconnect
- Patent number 9,565,766
- Issue date Feb 7, 2017
- Intel Corporation
- Nick Lindert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via and plug patterning with photobuckets for back end...
- Patent number 9,553,018
- Issue date Jan 24, 2017
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagonal hardmasks for improved overlay in fabricating back end of...
- Patent number 9,548,269
- Issue date Jan 17, 2017
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures
- Patent number 9,455,224
- Issue date Sep 27, 2016
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming interconnects in porous dielectric materials
- Patent number 9,406,615
- Issue date Aug 2, 2016
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via patterning with multi-colored photobuckets for bac...
- Patent number 9,406,512
- Issue date Aug 2, 2016
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming interconnect layers having tight pitch intercon...
- Patent number 9,379,010
- Issue date Jun 28, 2016
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses to form self-aligned caps
- Patent number 9,373,584
- Issue date Jun 21, 2016
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via and plug patterning with photobuckets for back end...
- Patent number 9,236,342
- Issue date Jan 12, 2016
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagonal hardmasks for improved overlay in fabricating back end of...
- Patent number 9,209,077
- Issue date Dec 8, 2015
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures
- Patent number 9,064,872
- Issue date Jun 23, 2015
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via patterning with multi-colored photobuckets for bac...
- Patent number 9,041,217
- Issue date May 26, 2015
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures
- Patent number 8,772,938
- Issue date Jul 8, 2014
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal chemistry for selectively etching metal hard mask
- Patent number 8,080,475
- Issue date Dec 20, 2011
- Intel Corporation
- Vijayakumar SubramanyaRao RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS
- Publication number 20220270978
- Publication date Aug 25, 2022
- Intel Corporation
- Boyan BOYANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS
- Publication number 20200321282
- Publication date Oct 8, 2020
- Intel Corporation
- Boyan BOYANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS
- Publication number 20190393157
- Publication date Dec 26, 2019
- Intel Corporation
- Boyan BOYANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DORIC PILLAR SUPPORTED MASKLESS AIRGAP STRUCTURE FOR CAPACITANCE BE...
- Publication number 20180145035
- Publication date May 24, 2018
- Intel Corporation
- Kanwal Jit SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS
- Publication number 20180086627
- Publication date Mar 29, 2018
- Intel Corporation
- Kevin LAI LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND STRUCTURE TO CONTACT TIGHT PITCH CONDUCTIVE LAYERS WITH...
- Publication number 20170330761
- Publication date Nov 16, 2017
- Intel Corporation
- Jasmeet S. CHAWLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA SELF ALIGNMENT AND SHORTING IMPROVEMENT WITH AIRGAP INTEGRATION...
- Publication number 20170250104
- Publication date Aug 31, 2017
- Intel Corporation
- Kanwal Jit SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS
- Publication number 20170207120
- Publication date Jul 20, 2017
- Intel Corporation
- Boyan BOYANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF DRAM CAPACITOR AMONG METAL INTERCONNECT
- Publication number 20170148868
- Publication date May 25, 2017
- Intel Corporation
- Nick Lindert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES
- Publication number 20170011998
- Publication date Jan 12, 2017
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING INTERCONNECTS IN POROUS DIELECTRIC MATERIALS
- Publication number 20160343665
- Publication date Nov 24, 2016
- Intel Corporation
- CHRISTOPHER J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGONAL HARDMASKS FOR IMPROVED OVERLAY IN FABRICATING BACK END OF...
- Publication number 20160126184
- Publication date May 5, 2016
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA AND PLUG PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20160104642
- Publication date Apr 14, 2016
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES
- Publication number 20150294935
- Publication date Oct 15, 2015
- Intel Corporation
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS
- Publication number 20150270224
- Publication date Sep 24, 2015
- Intel Corporation
- Boyan BOYANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA PATTERNING WITH MULTI-COLORED PHOTOBUCKETS FOR BAC...
- Publication number 20150255284
- Publication date Sep 10, 2015
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING INTERCONNECT LAYERS HAVING TIGHT PITCH INTERCON...
- Publication number 20150214094
- Publication date Jul 30, 2015
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING INTERCONNECTS IN POROUS DIELECTRIC MATERIALS
- Publication number 20150179578
- Publication date Jun 25, 2015
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGONAL HARDMASKS FOR IMPROVED OVERLAY IN FABRICATING BACK END OF...
- Publication number 20150179513
- Publication date Jun 25, 2015
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA PATTERNING WITH MULTI-COLORED PHOTOBUCKETS FOR BAC...
- Publication number 20150171009
- Publication date Jun 18, 2015
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA AND PLUG PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20150171010
- Publication date Jun 18, 2015
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES
- Publication number 20140312508
- Publication date Oct 23, 2014
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES
- Publication number 20140151893
- Publication date Jun 5, 2014
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING BARRIER WALLS, CAPPING, OR ALLOYS /COMPOUNDS WITHIN METAL L...
- Publication number 20140091467
- Publication date Apr 3, 2014
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ENCAPSULATED CONDUCTIVE LINES
- Publication number 20130292797
- Publication date Nov 7, 2013
- Nick Lindert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF DRAM CAPACITOR AMONG METAL INTERCONNECT
- Publication number 20130271938
- Publication date Oct 17, 2013
- Intel Corporation
- Nick Lindert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS
- Publication number 20130256899
- Publication date Oct 3, 2013
- Boyan Boyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL CHEMISTRY FOR SELECTIVELY ETCHING METAL HARD MASK
- Publication number 20100190347
- Publication date Jul 29, 2010
- Vijayakumar SubramanyaRao RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS

Kanwal Jit Singh

Person

Patents Grantslast 30 patents

Methods and apparatuses to form self-aligned caps

Doric pillar supported maskless airgap structure for capacitance be...

Methods and apparatuses to form self-aligned caps

Via self alignment and shorting improvement with airgap integration...

Method and structure to contact tight pitch conductive layers with...

Techniques for forming interconnects in porous dielectric materials

Semiconductor interconnect structures

Forming barrier walls, capping, or alloys /compounds within metal l...

Methods and apparatuses to form self-aligned caps

Formation of DRAM capacitor among metal interconnect

Self-aligned via and plug patterning with photobuckets for back end...

Diagonal hardmasks for improved overlay in fabricating back end of...

Semiconductor interconnect structures

Techniques for forming interconnects in porous dielectric materials

Self-aligned via patterning with multi-colored photobuckets for bac...

Methods for forming interconnect layers having tight pitch intercon...

Methods and apparatuses to form self-aligned caps

Self-aligned via and plug patterning with photobuckets for back end...

Diagonal hardmasks for improved overlay in fabricating back end of...

Semiconductor interconnect structures

Self-aligned via patterning with multi-colored photobuckets for bac...

Semiconductor interconnect structures

Removal chemistry for selectively etching metal hard mask

Patents Applicationslast 30 patents

METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS

METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS

METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS

DORIC PILLAR SUPPORTED MASKLESS AIRGAP STRUCTURE FOR CAPACITANCE BE...

INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS

METHOD AND STRUCTURE TO CONTACT TIGHT PITCH CONDUCTIVE LAYERS WITH...

VIA SELF ALIGNMENT AND SHORTING IMPROVEMENT WITH AIRGAP INTEGRATION...

METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS

FORMATION OF DRAM CAPACITOR AMONG METAL INTERCONNECT

SEMICONDUCTOR INTERCONNECT STRUCTURES

TECHNIQUES FOR FORMING INTERCONNECTS IN POROUS DIELECTRIC MATERIALS

DIAGONAL HARDMASKS FOR IMPROVED OVERLAY IN FABRICATING BACK END OF...

SELF-ALIGNED VIA AND PLUG PATTERNING WITH PHOTOBUCKETS FOR BACK END...

SEMICONDUCTOR INTERCONNECT STRUCTURES

METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS

SELF-ALIGNED VIA PATTERNING WITH MULTI-COLORED PHOTOBUCKETS FOR BAC...

METHODS FOR FORMING INTERCONNECT LAYERS HAVING TIGHT PITCH INTERCON...

TECHNIQUES FOR FORMING INTERCONNECTS IN POROUS DIELECTRIC MATERIALS

DIAGONAL HARDMASKS FOR IMPROVED OVERLAY IN FABRICATING BACK END OF...

SELF-ALIGNED VIA PATTERNING WITH MULTI-COLORED PHOTOBUCKETS FOR BAC...

SELF-ALIGNED VIA AND PLUG PATTERNING WITH PHOTOBUCKETS FOR BACK END...

SEMICONDUCTOR INTERCONNECT STRUCTURES

SEMICONDUCTOR INTERCONNECT STRUCTURES

FORMING BARRIER WALLS, CAPPING, OR ALLOYS /COMPOUNDS WITHIN METAL L...

FULLY ENCAPSULATED CONDUCTIVE LINES

FORMATION OF DRAM CAPACITOR AMONG METAL INTERCONNECT

METHODS AND APPARATUSES TO FORM SELF-ALIGNED CAPS

REMOVAL CHEMISTRY FOR SELECTIVELY ETCHING METAL HARD MASK