Kao-Chih Liu

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Changhua County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Repackaging IC chip for fault identification
- Patent number 12,265,119
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming trench in IC chip through multiple trench formation and dep...
- Patent number 12,219,709
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Repackaging IC Chip For Fault Identification
- Publication number 20240036108
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Trench In IC Chip Through Multiple Trench Formation And Dep...
- Publication number 20240040701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Openings Through Carrier Substrate of IC Package Assembly f...
- Publication number 20240038587
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS