Kaori Matsumura

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Niigata-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Liquid epoxy resin composition for semiconductor encapsulation
- Patent number 8,470,936
- Issue date Jun 25, 2013
- Namics Corporation
- Pawel Czubarow
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND...
- Publication number 20130026660
- Publication date Jan 31, 2013
- NAMICS CORPORATION
- Pawel CZUBAROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND...
- Publication number 20130026661
- Publication date Jan 31, 2013
- NAMICS CORPORATION
- Pawel CZUBAROW
- H01 - BASIC ELECTRIC ELEMENTS