Kaori Umezawa

Person

Kamakura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, template, and method of manufacturing template
- Patent number 12,068,244
- Issue date Aug 20, 2024
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,776,823
- Issue date Oct 3, 2023
- Kioxia Corporation
- Mana Tanabe
- B08 - CLEANING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,443,963
- Issue date Sep 13, 2022
- Kioxia Corporation
- Mana Tanabe
- B08 - CLEANING
Information Patent Grant
Cleaning apparatus for semiconductor wafer
- Patent number 8,567,420
- Issue date Oct 29, 2013
- Kabushiki Kaisha Toshiba
- Minako Inukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,114,755
- Issue date Feb 14, 2012
- Kabushiki Kaisha Toshiba
- Ichiro Mizushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,538,047
- Issue date May 26, 2009
- Kabushiki Kaisha Toshiba
- Atsuko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with SOI region and bulk region and method of...
- Patent number 6,979,866
- Issue date Dec 27, 2005
- Kabushiki Kaisha Toshiba
- Atsushi Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating an SOI substrate, evaluation processor, and m...
- Patent number 6,963,630
- Issue date Nov 8, 2005
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a substrate having shallow trench isolation
- Patent number 6,919,260
- Issue date Jul 19, 2005
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,365,472
- Issue date Apr 2, 2002
- Kabushiki Kaisha Toshiba
- Kazunari Ishimaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having highly-doped source/drain regions with...
- Patent number 5,998,849
- Issue date Dec 7, 1999
- Kabushiki Kaisha Toshiba
- Kazunari Ishimaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having shallow trench isolation
- Patent number 5,994,756
- Issue date Nov 30, 1999
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240096653
- Publication date Mar 21, 2024
- SHIBAURA MECHATRONICS CORPORATION
- Kensuke DEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
- Publication number 20240096652
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Mana TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20220384218
- Publication date Dec 1, 2022
- KIOXIA Corporation
- Mana TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, TEMPLATE, AND METHOD OF MANUFACTURING TEMPLATE
- Publication number 20220302024
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Yasuhito YOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORIGINAL PLATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220082933
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Kaori UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20200294822
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Mana TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE, METHOD OF FABRICATING TEMPLATE, AND METHOD OF MANUFACTURI...
- Publication number 20190287794
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Kaori UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING APPARATUS FOR SEMICONDUCTOR WAFER AND CLEANING METHOD FOR...
- Publication number 20090255558
- Publication date Oct 15, 2009
- Minako Inukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20090250431
- Publication date Oct 8, 2009
- Minako INUKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090011570
- Publication date Jan 8, 2009
- Ichiro Mizushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20080064212
- Publication date Mar 13, 2008
- Yoshihiro Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20070004170
- Publication date Jan 4, 2007
- Atsuko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor cleaning apparatus and semiconductor cleaning method
- Publication number 20060213538
- Publication date Sep 28, 2006
- Kaori Umezawa
- B08 - CLEANING
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050186803
- Publication date Aug 25, 2005
- Kaori Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with SOI region and bulk region and method of...
- Publication number 20040108552
- Publication date Jun 10, 2004
- Atsushi Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for evaluating an SOI substrate, evaluation processor, and m...
- Publication number 20030128809
- Publication date Jul 10, 2003
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- G01 - MEASURING TESTING

Kaori Umezawa

Person

Patents Grantslast 30 patents

Semiconductor device, template, and method of manufacturing template

Substrate processing method and substrate processing apparatus

Substrate processing method and substrate processing apparatus

Cleaning apparatus for semiconductor wafer

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device with SOI region and bulk region and method of...

Method for evaluating an SOI substrate, evaluation processor, and m...

Method of manufacturing a substrate having shallow trench isolation

Semiconductor device and method of manufacturing the same

Semiconductor device having highly-doped source/drain regions with...

Substrate having shallow trench isolation

Patents Applicationslast 30 patents

SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR DEVICE, TEMPLATE, AND METHOD OF MANUFACTURING TEMPLATE

ORIGINAL PLATE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

TEMPLATE, METHOD OF FABRICATING TEMPLATE, AND METHOD OF MANUFACTURI...

CLEANING APPARATUS FOR SEMICONDUCTOR WAFER AND CLEANING METHOD FOR...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor cleaning apparatus and semiconductor cleaning method

Method of manufacturing semiconductor device

Semiconductor device with SOI region and bulk region and method of...

Method for evaluating an SOI substrate, evaluation processor, and m...