Kaori Watanabe

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device or semiconductor wafe...
- Patent number 7,566,663
- Issue date Jul 28, 2009
- NEC Electronics Corporation
- Kaori Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing contamination and method for fabricating semico...
- Patent number 7,442,652
- Issue date Oct 28, 2008
- NEC Electronics Corporation
- Hidemitsu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten metal removing solution and method for removing tungsten m...
- Patent number 7,351,354
- Issue date Apr 1, 2008
- Kanto Kagaku Kabushiki Kaisha
- Toshikazu Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of collecting impurities on surface of semiconductor wafer
- Patent number 6,911,096
- Issue date Jun 28, 2005
- NEC Electronics Corporation
- Kaori Watanabe
- B08 - CLEANING
Information Patent Grant
Chemical solution treatment apparatus for semiconductor substrate
- Patent number 6,877,518
- Issue date Apr 12, 2005
- NEC Electronics Corporation
- Kaori Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a semiconductor device
- Patent number 6,551,945
- Issue date Apr 22, 2003
- NEC Corporation
- Hidemitsu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remover for a ruthenium containing metal and use thereof
- Patent number 6,468,357
- Issue date Oct 22, 2002
- NEC Corporation
- Hidemitsu Aoki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Platinum group impurity recovery liquid and method for recovering p...
- Patent number 6,444,010
- Issue date Sep 3, 2002
- NEC Corporation
- Kaori Watanabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cleaning method for semiconductor substrate and cleaning solution
- Patent number 6,432,836
- Issue date Aug 13, 2002
- NEC Corporation
- Kaori Watanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for production of semiconductor device
- Patent number 6,245,650
- Issue date Jun 12, 2001
- NEC Corporation
- Kaori Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for pre-processing of semiconductor substrate...
- Patent number 6,164,133
- Issue date Dec 26, 2000
- NEC Corporation
- Kaori Watanabe
- G01 - MEASURING TESTING
Information Patent Grant
Wet processing apparatus having individual reactivating feedback pa...
- Patent number 5,549,798
- Issue date Aug 27, 1996
- NEC Corporation
- Hiroshi Kitajima
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing semiconductor device or semiconductor wafer
- Publication number 20070139857
- Publication date Jun 21, 2007
- NEC ELECTRONICS CORPORATION
- Kaori Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten metal removing solution and method for removing tungsten m...
- Publication number 20050156140
- Publication date Jul 21, 2005
- Kanto Kagaku Kabushiki Kaisha
- Toshikazu Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical solution treatment apparatus for semiconductor substrate
- Publication number 20030168088
- Publication date Sep 11, 2003
- Kaori Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing contamination and method for fabricating semico...
- Publication number 20030148627
- Publication date Aug 7, 2003
- Hidemitsu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of collecting impurities on surface of semiconductor wafer
- Publication number 20030084926
- Publication date May 8, 2003
- Kaori Watanabe
- B08 - CLEANING
Information Patent Application
Process for manufacturing a semiconductor device
- Publication number 20010024852
- Publication date Sep 27, 2001
- NEC Corporation
- Hidemitsu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remover for a ruthenium containing metal and use thereof
- Publication number 20010023701
- Publication date Sep 27, 2001
- NEC Corporation
- Hidemitsu Aoki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kaori Watanabe

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device or semiconductor wafe...

Method for removing contamination and method for fabricating semico...

Tungsten metal removing solution and method for removing tungsten m...

Method of collecting impurities on surface of semiconductor wafer

Chemical solution treatment apparatus for semiconductor substrate

Process for manufacturing a semiconductor device

Remover for a ruthenium containing metal and use thereof

Platinum group impurity recovery liquid and method for recovering p...

Cleaning method for semiconductor substrate and cleaning solution

Process for production of semiconductor device

Method and apparatus for pre-processing of semiconductor substrate...

Wet processing apparatus having individual reactivating feedback pa...

Patents Applicationslast 30 patents

Method for manufacturing semiconductor device or semiconductor wafer

Tungsten metal removing solution and method for removing tungsten m...

Chemical solution treatment apparatus for semiconductor substrate

Method for removing contamination and method for fabricating semico...

Method of collecting impurities on surface of semiconductor wafer

Process for manufacturing a semiconductor device

Remover for a ruthenium containing metal and use thereof