Kaoru HISHIKI

Person

Isa-shi, Kagoshima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame
- Patent number 11,404,286
- Issue date Aug 2, 2022
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting semiconductor element
- Patent number 11,062,983
- Issue date Jul 13, 2021
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 10,903,150
- Issue date Jan 26, 2021
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for mounting semiconductor element, lead frame, and substrat...
- Patent number 10,847,451
- Issue date Nov 24, 2020
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame
- Patent number 10,811,346
- Issue date Oct 20, 2020
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting semiconductor element
- Patent number 10,777,492
- Issue date Sep 15, 2020
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 10,763,196
- Issue date Sep 1, 2020
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-row wiring member for semiconductor device and method for man...
- Patent number 10,763,202
- Issue date Sep 1, 2020
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 10,727,171
- Issue date Jul 28, 2020
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-row wiring member for semiconductor device and method for man...
- Patent number 10,453,782
- Issue date Oct 22, 2019
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-row wiring member for semiconductor device and method for man...
- Patent number 10,312,187
- Issue date Jun 4, 2019
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-row LED wiring member and method for manufacturing the same
- Patent number 10,305,007
- Issue date May 28, 2019
- OHKUCHI MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing substrate for mounting semiconductor element
- Patent number 9,870,930
- Issue date Jan 16, 2018
- SH MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for manufacturing the same
- Patent number 9,735,096
- Issue date Aug 15, 2017
- SH MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor lead frame, semiconductor package, and manufacturing...
- Patent number 9,735,106
- Issue date Aug 15, 2017
- SH MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
- Publication number 20200312752
- Publication date Oct 1, 2020
- Ohkuchi Materials Co., Ltd.
- Kaoru Hishiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT, LEAD FRAME, AND SUBSTRAT...
- Publication number 20200312753
- Publication date Oct 1, 2020
- Ohkuchi Materials Co., Ltd.
- Kaoru Hishiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME
- Publication number 20200303287
- Publication date Sep 24, 2020
- Ohkuchi Materials Co., Ltd.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20200303288
- Publication date Sep 24, 2020
- Ohkuchi Materials Co., Ltd.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20200303210
- Publication date Sep 24, 2020
- Ohkuchi Materials Co., Ltd.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
- Publication number 20200303289
- Publication date Sep 24, 2020
- Ohkuchi Materials Co., Ltd.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20200303286
- Publication date Sep 24, 2020
- Ohkuchi Materials Co., Ltd.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROW WIRING MEMBER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20190139879
- Publication date May 9, 2019
- Ohkuchi Materials Co., Ltd.
- Kaoru HISHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROW WIRING MEMBER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20190096793
- Publication date Mar 28, 2019
- Ohkuchi Materials Co., Ltd.
- Kaoru HISHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROW WIRING MEMBER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20190088580
- Publication date Mar 21, 2019
- Ohkuchi Materials Co., Ltd.
- Kaoru HISHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20180158760
- Publication date Jun 7, 2018
- SH MATERIALS CO., LTD.
- Kaoru HISHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROW LED WIRING MEMBER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180033933
- Publication date Feb 1, 2018
- SH MATERIALS CO., LTD.
- Kaoru HISHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170236775
- Publication date Aug 17, 2017
- SH MATERIALS CO., LTD.
- Kaoru HISHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING...
- Publication number 20160343643
- Publication date Nov 24, 2016
- SH MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
- Publication number 20160079091
- Publication date Mar 17, 2016
- SH MATERIALS CO., LTD.
- Kaoru HISHIKI
- H01 - BASIC ELECTRIC ELEMENTS

Kaoru HISHIKI

Person

Patents Grantslast 30 patents

Lead frame

Substrate for mounting semiconductor element

Lead frame

Device for mounting semiconductor element, lead frame, and substrat...

Lead frame

Substrate for mounting semiconductor element

Lead frame

Multi-row wiring member for semiconductor device and method for man...

Lead frame

Multi-row wiring member for semiconductor device and method for man...

Multi-row wiring member for semiconductor device and method for man...

Multi-row LED wiring member and method for manufacturing the same

Method for producing substrate for mounting semiconductor element

Lead frame and method for manufacturing the same

Semiconductor lead frame, semiconductor package, and manufacturing...

Patents Applicationslast 30 patents

SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT

DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT, LEAD FRAME, AND SUBSTRAT...

LEAD FRAME

LEAD FRAME

LEAD FRAME

SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT

LEAD FRAME

MULTI-ROW WIRING MEMBER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MAN...

MULTI-ROW WIRING MEMBER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MAN...

MULTI-ROW WIRING MEMBER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MAN...

LEAD FRAME

MULTI-ROW LED WIRING MEMBER AND METHOD FOR MANUFACTURING THE SAME

LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING...

METHOD FOR PRODUCING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT