Kaoru Katayama

Person

Hatano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lighting system and liquid crystal display using the same
- Patent number 8,284,350
- Issue date Oct 9, 2012
- Hitachi, Ltd.
- Makoto Abe
- G02 - OPTICS
Information Patent Grant
Method for removing solder bumps from LSI
- Patent number 7,401,393
- Issue date Jul 22, 2008
- Hitachi, Ltd.
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser printing method and apparatus
- Patent number 6,795,105
- Issue date Sep 21, 2004
- Hitachi, Ltd.
- Kaoru Katayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing solder bumps from LSI
- Patent number 6,739,045
- Issue date May 25, 2004
- Hitachi, Ltd.
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for sealing liquid coolant into module
- Patent number 6,457,228
- Issue date Oct 1, 2002
- Hitachi, Ltd.
- Natsuo Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and a method for removing solder from an object
- Patent number 6,435,401
- Issue date Aug 20, 2002
- Hitachi, Ltd.
- Takeshi Miitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser printing method and apparatus for printing characters
- Patent number 6,433,810
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Surface reformation method of high polymer material
- Patent number 6,423,405
- Issue date Jul 23, 2002
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,410,881
- Issue date Jun 25, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removing apparatus
- Patent number 6,325,270
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Takeshi Kuroda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module
- Patent number 6,281,575
- Issue date Aug 28, 2001
- Hitachi, Ltd.
- Toru Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,269,998
- Issue date Aug 7, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,161,748
- Issue date Dec 19, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,133,135
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted surface reformation method of high polymer material
- Patent number 6,017,424
- Issue date Jan 25, 2000
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 5,940,728
- Issue date Aug 17, 1999
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modifying conductive lines of an electronic circuit board...
- Patent number 5,832,595
- Issue date Nov 10, 1998
- Hitachi, Ltd.
- Shigenobu Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface reformation method of high polymer material
- Patent number 5,801,350
- Issue date Sep 1, 1998
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making electronic device
- Patent number 5,499,668
- Issue date Mar 19, 1996
- Hitachi, Ltd.
- Kaoru Katayama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and sealing structure and methods for manufacturing t...
- Patent number 5,262,614
- Issue date Nov 16, 1993
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser machining apparatus and method of the same
- Patent number 5,229,569
- Issue date Jul 20, 1993
- Hitachi, Ltd.
- Tateoki Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with a uniform conductive layer formed by equ...
- Patent number 5,023,407
- Issue date Jun 11, 1991
- Hitachi, Ltd.
- Mitugu Shirai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Liquid Crystal Display Device
- Publication number 20090096957
- Publication date Apr 16, 2009
- Ikuo Hiyama
- G02 - OPTICS
Information Patent Application
Method of Supplying Paste Solder Material and Metal Mask Therefor
- Publication number 20090014504
- Publication date Jan 15, 2009
- Hitachi, Ltd
- Akira Kamisaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lighting System and Liquid Crystal Display Using the Same
- Publication number 20080284946
- Publication date Nov 20, 2008
- Makoto ABE
- G02 - OPTICS
Information Patent Application
Method of supplying paste solder material and metal mask therefor
- Publication number 20060006213
- Publication date Jan 12, 2006
- Hitachi, Ltd
- Akira Kamisaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for removing solder bumps from LSI
- Publication number 20040206805
- Publication date Oct 21, 2004
- Hitachi, Ltd
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for removing solder bumps from LSI
- Publication number 20030034380
- Publication date Feb 20, 2003
- Hitachi, Ltd
- Motoko Kimura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Laser printing method and apparatus
- Publication number 20020093562
- Publication date Jul 18, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SURFACE REFORMATION METHOD OF HIGH POLYMER MATERIAL
- Publication number 20020048664
- Publication date Apr 25, 2002
- TSUTOMU SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for manufacturing electronic circuits
- Publication number 20010039725
- Publication date Nov 15, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS

Kaoru Katayama

Person

Patents Grantslast 30 patents

Lighting system and liquid crystal display using the same

Method for removing solder bumps from LSI

Laser printing method and apparatus

Method for removing solder bumps from LSI

Method for sealing liquid coolant into module

Apparatus and a method for removing solder from an object

Laser printing method and apparatus for printing characters

Surface reformation method of high polymer material

Process for manufacturing electronic circuits

Solder removing apparatus

Multi-chip module

Process for manufacturing electronic circuits

Process for manufacturing electronic circuits

Process for manufacturing electronic circuits

Laser assisted surface reformation method of high polymer material

Process for manufacturing electronic circuits

Method of modifying conductive lines of an electronic circuit board...

Surface reformation method of high polymer material

Process for making electronic device

Circuit board and sealing structure and methods for manufacturing t...

Laser machining apparatus and method of the same

Printed circuit board with a uniform conductive layer formed by equ...

Patents Applicationslast 30 patents

Liquid Crystal Display Device

Method of Supplying Paste Solder Material and Metal Mask Therefor

Lighting System and Liquid Crystal Display Using the Same

Method of supplying paste solder material and metal mask therefor

Method for removing solder bumps from LSI

Method for removing solder bumps from LSI

Laser printing method and apparatus

SURFACE REFORMATION METHOD OF HIGH POLYMER MATERIAL

Process for manufacturing electronic circuits