Kaoru Katoh

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Set of resin compositions for preparing system-in-package type semi...
- Patent number 9,018,281
- Issue date Apr 28, 2015
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,829,381
- Issue date Nov 9, 2010
- Shin-Etsu Chemical Co., Ltd.
- Kaoru Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid epoxy resin composition
- Patent number 7,642,661
- Issue date Jan 5, 2010
- Shin-Etsu Chemical Co., Ltd.
- Masatoshi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 7,169,833
- Issue date Jan 30, 2007
- Shin-Estu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SET OF RESIN COMPOSITIONS FOR PREPARING SYSTEM-IN-PACKAGE TYPE SEMI...
- Publication number 20120074596
- Publication date Mar 29, 2012
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION
- Publication number 20100016474
- Publication date Jan 21, 2010
- Masatoshi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION
- Publication number 20100001415
- Publication date Jan 7, 2010
- Masatoshi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20090142884
- Publication date Jun 4, 2009
- Kaoru KATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Set of resin compositions for preparing system-in-package type semi...
- Publication number 20080070054
- Publication date Mar 20, 2008
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing flip-chip type semiconductor device and semic...
- Publication number 20070134844
- Publication date Jun 14, 2007
- Shin-Etsu Chemical Co., Ltd.
- Kaoru Katoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition
- Publication number 20070116962
- Publication date May 24, 2007
- Shin-Etsu Chemical Co., Ltd.
- Masatoshi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition
- Publication number 20070104960
- Publication date May 10, 2007
- Shin-Etsu Chemical Co., Ltd.
- Masatoshi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition
- Publication number 20070104959
- Publication date May 10, 2007
- Shin-Etsu Chemical Co., Ltd.
- Masatoshi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition and semiconductor device
- Publication number 20040192810
- Publication date Sep 30, 2004
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kaoru Katoh

Person

Patents Grantslast 30 patents

Set of resin compositions for preparing system-in-package type semi...

Method of manufacturing a semiconductor device

Liquid epoxy resin composition

Liquid epoxy resin composition and semiconductor device

Patents Applicationslast 30 patents

SET OF RESIN COMPOSITIONS FOR PREPARING SYSTEM-IN-PACKAGE TYPE SEMI...

LIQUID EPOXY RESIN COMPOSITION

LIQUID EPOXY RESIN COMPOSITION

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Set of resin compositions for preparing system-in-package type semi...

Process for producing flip-chip type semiconductor device and semic...

Liquid epoxy resin composition

Liquid epoxy resin composition

Liquid epoxy resin composition

Liquid epoxy resin composition and semiconductor device