Kaoru Maekawa

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective etching with fluorine, oxygen and noble gas containing pl...
- Patent number 12,131,914
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process using dual memorization layer for multi-color sp...
- Patent number 11,380,579
- Issue date Jul 5, 2022
- Tokyo Electron Limited
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for low density silicon oxide for fusion bondi...
- Patent number 11,315,789
- Issue date Apr 26, 2022
- Tokyo Electron Limited
- Kiyotaka Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 11,120,999
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Koichi Yatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to reduce gouging for core removal processes using thermal...
- Patent number 10,978,300
- Issue date Apr 13, 2021
- Tokyo Electron Limited
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to reshape spacers for multi-patterning processes using the...
- Patent number 10,950,442
- Issue date Mar 16, 2021
- Tokyo Electron Limited
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to transfer patterns to a layer
- Patent number 10,916,428
- Issue date Feb 9, 2021
- Tokyo Electron Limited
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect patterning for back-end-of-line (BEOL) st...
- Patent number 10,886,176
- Issue date Jan 5, 2021
- Tokyo Electron Limited
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning low-k materials using thermal decomposition ma...
- Patent number 10,861,739
- Issue date Dec 8, 2020
- Tokyo Electron Limited
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform and method of operating for integrated end-to-end CMP-less...
- Patent number 10,861,744
- Issue date Dec 8, 2020
- Tokyo Electron Limited
- Ying Trickett
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor back end of line (BEOL) interconnect using multiple m...
- Patent number 10,777,456
- Issue date Sep 15, 2020
- Tokyo Electron Limited
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of integrated circuit fabrication with dual metal power rail
- Patent number 10,580,691
- Issue date Mar 3, 2020
- Tokyo Electron Limited
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact integration scheme
- Patent number 10,217,670
- Issue date Feb 26, 2019
- Tokyo Electron Limited
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of a self-forming barrier layer and a ruthenium metal l...
- Patent number 10,157,784
- Issue date Dec 18, 2018
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of corner rounding and trimming of nanowires by microwave pl...
- Patent number 10,008,564
- Issue date Jun 26, 2018
- Tokyo Electron Limited
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ALD barrier layer and CVD Ru liner for void-free Cu...
- Patent number 9,607,888
- Issue date Mar 28, 2017
- Tokyo Electron Limited
- Kai-Hung Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device for forming metal ele...
- Patent number 9,245,847
- Issue date Jan 26, 2016
- Tokyo Electron Limited
- Kenji Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering method and sputtering apparatus
- Patent number 9,121,094
- Issue date Sep 1, 2015
- Tokyo Electron Limited
- Kaoru Maekawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGES USING DIELECTRIC ALIGNMEN...
- Publication number 20230343606
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Hard Mask Integration
- Publication number 20230260801
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- Angelique Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Etching with Fluorine, Oxygen and Noble Gas Containing Pl...
- Publication number 20220199418
- Publication date Jun 23, 2022
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20220102160
- Publication date Mar 31, 2022
- TOKYO ELECTRON LIMITED
- Shigeru TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Process Using Dual Memorization Layer for Multi-Color Sp...
- Publication number 20210343586
- Publication date Nov 4, 2021
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING METHOD
- Publication number 20200381264
- Publication date Dec 3, 2020
- TOKYO ELECTRON LIMITED
- Koichi YATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Structure for Low Density Silicon Oxide for Fusion Bondi...
- Publication number 20200343092
- Publication date Oct 29, 2020
- TOKYO ELECTRON LIMITED
- Kiyotaka Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACK END OF LINE (BEOL) INTERCONNECT USING MULTIPLE M...
- Publication number 20200303253
- Publication date Sep 24, 2020
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO REDUCE GOUGING FOR CORE REMOVAL PROCESSES USING THERMAL...
- Publication number 20200020523
- Publication date Jan 16, 2020
- TOKYO ELECTRON LIMITED
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO TRANSFER PATTERNS TO A LAYER
- Publication number 20200020534
- Publication date Jan 16, 2020
- TOKYO ELECTRON LIMITED
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO RESHAPE SPACERS FOR MULTI-PATTERNING PROCESSES USING THE...
- Publication number 20200013619
- Publication date Jan 9, 2020
- TOKYO ELECTRON LIMITED
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Utilizing Thermal Decomposition Material To Relax Queue Time...
- Publication number 20190393084
- Publication date Dec 26, 2019
- TOKYO ELECTRON LIMITED
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Patterning Low-K Materials Using Thermal Decomposition Ma...
- Publication number 20190385903
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE INTERCONNECT FORMATION USING A FULLY SELF-ALIGNED SCHEME
- Publication number 20190304836
- Publication date Oct 3, 2019
- TOKYO ELECTRON LIMITED
- Yuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORM AND METHOD OF OPERATING FOR INTEGRATED END-TO-END CMP-LESS...
- Publication number 20190295887
- Publication date Sep 26, 2019
- TOKYO ELECTRON LIMITED
- Ying Trickett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTEGRATED CIRCUIT FABRICATION WITH DUAL METAL POWER RAIL
- Publication number 20180350665
- Publication date Dec 6, 2018
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND CONTACT INTEGRATION SCHEME
- Publication number 20180068899
- Publication date Mar 8, 2018
- TOKYO ELECTRON LIMITED
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF A SELF-FORMING BARRIER LAYER AND A RUTHENIUM METAL...
- Publication number 20170236752
- Publication date Aug 17, 2017
- TOKYO ELECTRON LIMITED
- Kai-Hung L. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORNER ROUNDING AND TRIMMING OF NANOWIRES BY MICROWAVE PL...
- Publication number 20170125517
- Publication date May 4, 2017
- TOKYO ELECTRON LIMITED
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MANGANESE-CONTAINING FILM
- Publication number 20160326646
- Publication date Nov 10, 2016
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu...
- Publication number 20150221550
- Publication date Aug 6, 2015
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150126027
- Publication date May 7, 2015
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MANGANESE-CONTAINING FILM
- Publication number 20150110975
- Publication date Apr 23, 2015
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20150021775
- Publication date Jan 22, 2015
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AN...
- Publication number 20140374904
- Publication date Dec 25, 2014
- Kenji MATSUMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Manufacturing method for semiconductor device and manufacturing dev...
- Publication number 20090017621
- Publication date Jan 15, 2009
- TOKYO ELECTRON LIMITED
- Takuji Sako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sputtering method and sputtering apparatus
- Publication number 20080230375
- Publication date Sep 25, 2008
- TOKYO ELECTRON LIMITED
- Kaoru Maekawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ST...
- Publication number 20080184543
- Publication date Aug 7, 2008
- TOKYO ELECTRON LIMITED
- Takuji Sako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for semiconductor device, semiconductor device...
- Publication number 20080079169
- Publication date Apr 3, 2008
- TOKYO ELECTRON LIMITED
- Kaoru MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Kaoru Maekawa

Person

Patents Grantslast 30 patents

Selective etching with fluorine, oxygen and noble gas containing pl...

Method and process using dual memorization layer for multi-color sp...

Method and structure for low density silicon oxide for fusion bondi...

Plasma etching method

Methods to reduce gouging for core removal processes using thermal...

Methods to reshape spacers for multi-patterning processes using the...

Method to transfer patterns to a layer

Self-aligned interconnect patterning for back-end-of-line (BEOL) st...

Method of patterning low-k materials using thermal decomposition ma...

Platform and method of operating for integrated end-to-end CMP-less...

Semiconductor back end of line (BEOL) interconnect using multiple m...

Method of integrated circuit fabrication with dual metal power rail

Wrap-around contact integration scheme

Integration of a self-forming barrier layer and a ruthenium metal l...

Method of corner rounding and trimming of nanowires by microwave pl...

Integration of ALD barrier layer and CVD Ru liner for void-free Cu...

Method for manufacturing semiconductor device for forming metal ele...

Sputtering method and sputtering apparatus

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR PACKAGES USING DIELECTRIC ALIGNMEN...

Metal Hard Mask Integration

Selective Etching with Fluorine, Oxygen and Noble Gas Containing Pl...

ETCHING METHOD AND ETCHING APPARATUS

Method and Process Using Dual Memorization Layer for Multi-Color Sp...

PLASMA ETCHING METHOD

Method And Structure for Low Density Silicon Oxide for Fusion Bondi...

SEMICONDUCTOR BACK END OF LINE (BEOL) INTERCONNECT USING MULTIPLE M...

METHODS TO REDUCE GOUGING FOR CORE REMOVAL PROCESSES USING THERMAL...

METHOD TO TRANSFER PATTERNS TO A LAYER

METHODS TO RESHAPE SPACERS FOR MULTI-PATTERNING PROCESSES USING THE...

Method Utilizing Thermal Decomposition Material To Relax Queue Time...

Method of Patterning Low-K Materials Using Thermal Decomposition Ma...

SUBTRACTIVE INTERCONNECT FORMATION USING A FULLY SELF-ALIGNED SCHEME

PLATFORM AND METHOD OF OPERATING FOR INTEGRATED END-TO-END CMP-LESS...

METHOD OF INTEGRATED CIRCUIT FABRICATION WITH DUAL METAL POWER RAIL

WRAP-AROUND CONTACT INTEGRATION SCHEME

INTEGRATION OF A SELF-FORMING BARRIER LAYER AND A RUTHENIUM METAL...

METHOD OF CORNER ROUNDING AND TRIMMING OF NANOWIRES BY MICROWAVE PL...

METHOD FOR FORMING MANGANESE-CONTAINING FILM

INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FORMING MANGANESE-CONTAINING FILM

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AN...

Manufacturing method for semiconductor device and manufacturing dev...

Sputtering method and sputtering apparatus

METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ST...

Manufacturing method for semiconductor device, semiconductor device...