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Kaoru Yajima
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Beppu-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Method for low loop wire bonding
Patent number
7,475,802
Issue date
Jan 13, 2009
Texas Instruments Incorporated
Kaoru Yajima
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Patents Applications
last 30 patents
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Patent Application
System and method for low loop wire bonding
Publication number
20050242159
Publication date
Nov 3, 2005
TEXAS INSTRUMENTS INCORPORATED
Kaoru Yajima
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR