Kar Weng YAN

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation process for double-sided cooled packages
- Patent number 11,955,347
- Issue date Apr 9, 2024
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible sinter tool for bonding semiconductor devices
- Patent number 11,676,937
- Issue date Jun 13, 2023
- ASMPT SINGAPORE PTE. LTD.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided molding for encapsulating electronic devices
- Patent number 11,621,181
- Issue date Apr 4, 2023
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
- Publication number 20230178382
- Publication date Jun 8, 2023
- ASMPT SINGAPORE PTE. LTD
- Teng Hock KUAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20220359459
- Publication date Nov 10, 2022
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES
- Publication number 20210351049
- Publication date Nov 11, 2021
- ASM Technology Singapore Pte Ltd
- Teng Hock KUAH
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS