Membership
Tour
Register
Log in
Karen P. McLaughlin
Follow
Person
Poughkeepsie, NY, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Flip chip packaging rework
Patent number
11,121,101
Issue date
Sep 14, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge support structure
Patent number
10,957,650
Issue date
Mar 23, 2021
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Determining crackstop strength of integrated circuit assembly at th...
Patent number
9,947,598
Issue date
Apr 17, 2018
International Business Machines Corporation
Krishna R. Tunga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual layer stack for contact formation
Patent number
9,401,336
Issue date
Jul 26, 2016
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including passivation layer encapsulant
Patent number
9,214,385
Issue date
Dec 15, 2015
GLOBALFOUNDRIES Inc.
Brian M. Erwin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Far back end of the line metallization method and structures
Patent number
8,937,009
Issue date
Jan 20, 2015
International Business Machines Corporation
Timothy H. Daubenspeck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of performing processes on features with electricity
Patent number
5,985,128
Issue date
Nov 16, 1999
International Business Machines Corporation
Shaji Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of performing processes on features with electricity
Patent number
5,935,404
Issue date
Aug 10, 1999
International Business Machines Corporation
Shaji Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having etched-back silver-copper braze
Patent number
5,896,869
Issue date
Apr 27, 1999
International Business Machines Corporation
Joseph Francis Maniscalco
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for plating pin grid array packaging modules
Patent number
5,869,139
Issue date
Feb 9, 1999
International Business Machines Corporation
Glen N. Biggs
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
FLIP CHIP PACKAGING REWORK
Publication number
20210242146
Publication date
Aug 5, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE SUPPORT STRUCTURE
Publication number
20210057341
Publication date
Feb 25, 2021
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL LAYER STACK FOR CONTACT FORMATION
Publication number
20160126201
Publication date
May 5, 2016
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT
Publication number
20160035641
Publication date
Feb 4, 2016
GLOBALFOUNDRIES INC.
Brian M. Erwin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES
Publication number
20140319522
Publication date
Oct 30, 2014
International Business Machines Corporation
Timothy H. Daubenspeck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT
Publication number
20140183757
Publication date
Jul 3, 2014
International Business Machines Corporation
Brian M. Erwin
H01 - BASIC ELECTRIC ELEMENTS