Karine Saxod

Person

Les Marches, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating an electronic device comprising an optical chip
- Patent number 12,066,678
- Issue date Aug 20, 2024
- STMicroelectronics (Grenoble 2) SAS
- Nicolas Mastromauro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, systems, and apparatuses for electromagnetic shielding
- Patent number 11,974,419
- Issue date Apr 30, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a cover for an electronic package and elec...
- Patent number 11,688,815
- Issue date Jun 27, 2023
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a carrier substrate and an encapsulati...
- Patent number 11,664,475
- Issue date May 30, 2023
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an optical chip and method of fabrication
- Patent number 11,609,402
- Issue date Mar 21, 2023
- STMicroelectronics (Grenoble 2) SAS
- Nicolas Mastromauro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover for an electronic circuit package
- Patent number 11,546,059
- Issue date Jan 3, 2023
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation cover for an electronic package and fabrication process
- Patent number 11,437,527
- Issue date Sep 6, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an encapsulation cover for an electronic p...
- Patent number 11,114,312
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover for an electronic circuit package
- Patent number 10,998,470
- Issue date May 4, 2021
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover for an electronic circuit package
- Patent number 10,965,376
- Issue date Mar 30, 2021
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an optical chip and method of fabrication
- Patent number 10,923,638
- Issue date Feb 16, 2021
- STMicroelectronics (Grenoble 2) SAS
- Nicolas Mastromauro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a cover for an electronic package and elec...
- Patent number 10,833,208
- Issue date Nov 10, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Encapsulation cover for an electronic package and method of fabrica...
- Patent number 10,748,883
- Issue date Aug 18, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method
- Patent number 10,483,181
- Issue date Nov 19, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic housing including a grooved cover
- Patent number 10,480,994
- Issue date Nov 19, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a cover for an electronic package and electronic...
- Patent number 10,483,408
- Issue date Nov 19, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing an encapsulation cover for an electronic p...
- Patent number 10,325,784
- Issue date Jun 18, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,177,098
- Issue date Jan 8, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic device including a protective wafer bonded to a...
- Patent number 9,773,740
- Issue date Sep 26, 2017
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabrication of electronic devices and electronic device...
- Patent number 9,472,692
- Issue date Oct 18, 2016
- STMicroelectronics (Grenoble 2) SAS
- Marika Sorrieul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a substrate board equipped with a loca...
- Patent number 9,420,685
- Issue date Aug 16, 2016
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package with a heat conductor
- Patent number 9,101,077
- Issue date Aug 4, 2015
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20230411271
- Publication date Dec 21, 2023
- STMicroelectronics (Grenoble 2) SAS
- Luc PETIT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INTEGRATING AN ANTENNA AND METHOD OF FABRICATING...
- Publication number 20230402745
- Publication date Dec 14, 2023
- STMicroelectronics (Grenoble 2) SAS
- Florian PERMINJAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING A CARRIER SUBSTRATE AND AN ENCAPSULATI...
- Publication number 20230253519
- Publication date Aug 10, 2023
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION
- Publication number 20230194820
- Publication date Jun 22, 2023
- STMicroelectronics (Grenoble 2) SAS
- Nicolas MASTROMAURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS
- Publication number 20220029034
- Publication date Jan 27, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FOR AN ELECTRONIC CIRCUIT PACKAGE
- Publication number 20210159985
- Publication date May 27, 2021
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel RIVIERE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING A CARRIER SUBSTRATE AND AN ENCAPSULATI...
- Publication number 20210143294
- Publication date May 13, 2021
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION
- Publication number 20210135072
- Publication date May 6, 2021
- STMicroelectronics (Grenoble 2) SAS
- Nicolas MASTROMAURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20210043780
- Publication date Feb 11, 2021
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS
- Publication number 20200303565
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20200258850
- Publication date Aug 13, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION
- Publication number 20200096720
- Publication date Mar 26, 2020
- STMicroelectronics (Grenoble 2) SAS
- Nicolas MASTROMAURO
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION
- Publication number 20200098958
- Publication date Mar 26, 2020
- STMicroelectronics (Grenoble 2) SAS
- Nicolas MASTROMAURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20200020815
- Publication date Jan 16, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING COVER FOR AN ELECTRONIC PACKAGE AND FABRICATING PROCESS
- Publication number 20190280130
- Publication date Sep 12, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC UNITS
- Publication number 20190267349
- Publication date Aug 29, 2019
- STMicroelectronics (Grenoble 2) SAS
- Marie-Astrid PIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...
- Publication number 20190252212
- Publication date Aug 15, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FOR AN ELECTRONIC CIRCUIT PACKAGE
- Publication number 20190190606
- Publication date Jun 20, 2019
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel RIVIERE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC CIRCUIT PACKAGE COVER
- Publication number 20190189860
- Publication date Jun 20, 2019
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel RIVIERE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FOR AN ELECTRONIC CIRCUIT PACKAGE
- Publication number 20190189859
- Publication date Jun 20, 2019
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel RIVIERE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS
- Publication number 20190157469
- Publication date May 23, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND METHOD OF FABRICA...
- Publication number 20190139947
- Publication date May 9, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD
- Publication number 20190027416
- Publication date Jan 24, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine SAXOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20180190511
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Alexandre Mas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC...
- Publication number 20180190838
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...
- Publication number 20180190512
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC HOUSING INCLUDING A GROOVED COVER
- Publication number 20180058920
- Publication date Mar 1, 2018
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20170133520
- Publication date May 11, 2017
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK
- Publication number 20170127567
- Publication date May 4, 2017
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Karine Saxod

Person

Patents Grantslast 30 patents

Method of fabricating an electronic device comprising an optical chip

Method, systems, and apparatuses for electromagnetic shielding

Method for manufacturing a cover for an electronic package and elec...

Electronic device comprising a carrier substrate and an encapsulati...

Electronic device comprising an optical chip and method of fabrication

Cover for an electronic circuit package

Encapsulation cover for an electronic package and fabrication process

Method for fabricating an electronic device comprising forming an i...

Method for manufacturing an encapsulation cover for an electronic p...

Cover for an electronic circuit package

Cover for an electronic circuit package

Electronic device comprising an optical chip and method of fabrication

Method for manufacturing a cover for an electronic package and elec...

Encapsulation cover for an electronic package and method of fabrica...

Method for fabricating an electronic device and a stacked electroni...

Electronic package and fabrication method

Electronic housing including a grooved cover

Method for making a cover for an electronic package and electronic...

Method for manufacturing an encapsulation cover for an electronic p...

Method for fabricating an electronic device and a stacked electroni...

Stacked electronic device including a protective wafer bonded to a...

Process of fabrication of electronic devices and electronic device...

Electronic device comprising a substrate board equipped with a loca...

Electronic component package with a heat conductor

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES

ELECTRONIC DEVICE INTEGRATING AN ANTENNA AND METHOD OF FABRICATING...

ELECTRONIC DEVICE COMPRISING A CARRIER SUBSTRATE AND AN ENCAPSULATI...

ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION

ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS

COVER FOR AN ELECTRONIC CIRCUIT PACKAGE

ELECTRONIC DEVICE COMPRISING A CARRIER SUBSTRATE AND AN ENCAPSULATI...

ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION

ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

ENCAPSULATING COVER FOR AN ELECTRONIC PACKAGE AND FABRICATING PROCESS

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC UNITS

METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...

COVER FOR AN ELECTRONIC CIRCUIT PACKAGE

ELECTRONIC CIRCUIT PACKAGE COVER

COVER FOR AN ELECTRONIC CIRCUIT PACKAGE

ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS

ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND METHOD OF FABRICA...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

ELECTRONIC PACKAGE AND FABRICATION METHOD

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC...

METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...

ELECTRONIC HOUSING INCLUDING A GROOVED COVER

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK