Karine Turcotte

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Montreal, CA

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic wafer-level packaging for MEMS devices with low-temperatur...
- Patent number 7,291,513
- Issue date Nov 6, 2007
- DALSA Semiconductor Inc.
- Luc Ouellet
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Hermetic wafer-level packaging for MEMS devices with low-temperatur...
- Publication number 20050142685
- Publication date Jun 30, 2005
- DALSA Semiconductor Inc.
- Luc Ouellet
- B81 - MICRO-STRUCTURAL TECHNOLOGY