Karl B. Levy

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming all tungsten contacts and lines
- Patent number 8,367,546
- Issue date Feb 5, 2013
- Novellus Systems, Inc.
- Raashina Humayun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving uniformity and adhesion of low resistivity tun...
- Patent number 8,329,576
- Issue date Dec 11, 2012
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Architecture for high throughput semiconductor processing applications
- Patent number 8,192,131
- Issue date Jun 5, 2012
- Novellus Systems, Inc.
- Craig L. Stevens
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for forming all tungsten contacts and lines
- Patent number 8,053,365
- Issue date Nov 8, 2011
- Novellus Systems, Inc.
- Raashina Humayun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving uniformity and adhesion of low resistivity tun...
- Patent number 7,772,114
- Issue date Aug 10, 2010
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of tungsten nitride
- Patent number 7,691,749
- Issue date Apr 6, 2010
- Novellus Systems, Inc.
- Karl B. Levy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming low-resistivity tungsten interconnects
- Patent number 7,262,125
- Issue date Aug 28, 2007
- Novellus Systems, Inc.
- Panya Wongsenakhum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing tungsten film roughness and improving step cove...
- Patent number 7,141,494
- Issue date Nov 28, 2006
- Novellus Systems, Inc.
- Sang-Hyeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of tungsten nitride
- Patent number 7,005,372
- Issue date Feb 28, 2006
- Novellus Systems, Inc.
- Karl B. Levy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Architecture for high throughput semiconductor processing applications
- Patent number 6,977,014
- Issue date Dec 20, 2005
- Novellus Systems, Inc.
- Craig L. Stevens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for depositing superior Ta (N) copper thin fil...
- Patent number 6,905,959
- Issue date Jun 14, 2005
- Novellus Systems, Inc.
- Kaihan A. Ashtiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition systems and methods
- Patent number 6,902,620
- Issue date Jun 7, 2005
- Novellus Systems, Inc.
- Thomas R. Omstead
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Passivation of copper in dual damascene metalization
- Patent number 6,554,914
- Issue date Apr 29, 2003
- Novellus Systems, Inc.
- Robert T. Rozbicki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for depositing superior Ta(N)/copper thin film...
- Patent number 6,541,371
- Issue date Apr 1, 2003
- Novellus Systems, Inc.
- Kaihan A. Ashtiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing diffusion barrier for copper interconnect in i...
- Patent number 6,534,404
- Issue date Mar 18, 2003
- Novellus Systems, Inc.
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of erosion profile and process characteristics in magnetron...
- Patent number 6,500,321
- Issue date Dec 31, 2002
- Novellus Systems, Inc.
- Kaihan A. Ashtiani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for enhanced degassing of semiconductor wafers...
- Patent number 6,497,734
- Issue date Dec 24, 2002
- Novellus Systems, Inc.
- Kenneth K. Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling plasma uniformity across a sub...
- Patent number 6,497,796
- Issue date Dec 24, 2002
- Novellus Systems, Inc.
- Kaihan A. Ashtiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition reactor including magnet to control flow...
- Patent number 6,444,105
- Issue date Sep 3, 2002
- Novellus Systems, Inc.
- Kwok F. Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling erosion profile in hollow cath...
- Patent number 6,193,854
- Issue date Feb 27, 2001
- Novellus Systems, Inc.
- Kwok Fai Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for controlling plasma uniformity across a sub...
- Patent number 6,179,973
- Issue date Jan 30, 2001
- Novellus Systems, Inc.
- Kwok F. Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch system
- Patent number 5,976,310
- Issue date Nov 2, 1999
- Applied Materials, Inc.
- Karl B. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer diffusion barriers
- Patent number 5,942,799
- Issue date Aug 24, 1999
- Novellus Systems, Inc.
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching system
- Patent number 5,298,465
- Issue date Mar 29, 1994
- Applied Materials, Inc.
- Karl B. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically enhanced plasma reactor system for semiconductor proce...
- Patent number 5,225,024
- Issue date Jul 6, 1993
- Applied Materials, Inc.
- Peter R. Hanley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming capacitor in trench of semiconductor wafer by im...
- Patent number 5,183,775
- Issue date Feb 2, 1993
- Applied Materials, Inc.
- Karl B. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for multi-layer photoresist etching with minimal feature un...
- Patent number 5,126,231
- Issue date Jun 30, 1992
- Applied Materials, Inc.
- Karl B. Levy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Corrosion-free aluminum etching process for fabricating an integrat...
- Patent number 5,126,008
- Issue date Jun 30, 1992
- Applied Materials, Inc.
- Karl B. Levy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING ALL TUNGSTEN CONTACTS AND LINES
- Publication number 20120040530
- Publication date Feb 16, 2012
- Raashina HUMAYUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR IMPROVING UNIFORMITY AND ADHESION OF LOW RESISTIVITY TUN...
- Publication number 20100273327
- Publication date Oct 28, 2010
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING ALL TUNGSTEN CONTACTS AND LINES
- Publication number 20090163025
- Publication date Jun 25, 2009
- Novellus Systems, Inc.
- Raashina Humayun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR IMPROVING UNIFORMITY AND ADHESION OF LOW RESISTIVITY TUN...
- Publication number 20090149022
- Publication date Jun 11, 2009
- Novellus Systems, Inc.
- Lana Hiului Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Deposition of tungsten nitride
- Publication number 20060094238
- Publication date May 4, 2006
- Novellus Systems, Inc.
- Karl B. Levy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for reducing tungsten film roughness and improving step cove...
- Publication number 20050031786
- Publication date Feb 10, 2005
- Novellus Systems, Inc.
- Sang-Hyeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming low-resistivity tungsten interconnects
- Publication number 20040202786
- Publication date Oct 14, 2004
- Novellus Systems, Inc.
- Panya Wongsenakhum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Deposition of tungsten nitride
- Publication number 20040142557
- Publication date Jul 22, 2004
- Novellus Systems, Inc.
- Karl B. Levy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Karl B. Levy

Person

Patents Grantslast 30 patents

Methods for forming all tungsten contacts and lines

Method for improving uniformity and adhesion of low resistivity tun...

Architecture for high throughput semiconductor processing applications

Methods for forming all tungsten contacts and lines

Method for improving uniformity and adhesion of low resistivity tun...

Deposition of tungsten nitride

Method of forming low-resistivity tungsten interconnects

Method for reducing tungsten film roughness and improving step cove...

Deposition of tungsten nitride

Architecture for high throughput semiconductor processing applications

Apparatus and method for depositing superior Ta (N) copper thin fil...

Atomic layer deposition systems and methods

Passivation of copper in dual damascene metalization

Apparatus and method for depositing superior Ta(N)/copper thin film...

Method of depositing diffusion barrier for copper interconnect in i...

Control of erosion profile and process characteristics in magnetron...

Apparatus and method for enhanced degassing of semiconductor wafers...

Apparatus and method for controlling plasma uniformity across a sub...

Physical vapor deposition reactor including magnet to control flow...

Apparatus and method for controlling erosion profile in hollow cath...

Apparatus and method for controlling plasma uniformity across a sub...

Plasma etch system

Multilayer diffusion barriers

Plasma etching system

Magnetically enhanced plasma reactor system for semiconductor proce...

Method for forming capacitor in trench of semiconductor wafer by im...

Process for multi-layer photoresist etching with minimal feature un...

Corrosion-free aluminum etching process for fabricating an integrat...

Patents Applicationslast 30 patents

METHODS FOR FORMING ALL TUNGSTEN CONTACTS AND LINES

METHOD FOR IMPROVING UNIFORMITY AND ADHESION OF LOW RESISTIVITY TUN...

METHODS FOR FORMING ALL TUNGSTEN CONTACTS AND LINES

METHOD FOR IMPROVING UNIFORMITY AND ADHESION OF LOW RESISTIVITY TUN...

Deposition of tungsten nitride

Method for reducing tungsten film roughness and improving step cove...

Method of forming low-resistivity tungsten interconnects

Deposition of tungsten nitride