Karl Emerson Mautz

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer scribing method and wafer scribing device
- Patent number 6,914,006
- Issue date Jul 5, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Martin Peiter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for defining alignment marks in a semiconductor wafer
- Patent number 6,902,986
- Issue date Jun 7, 2005
- FREESCALE SEMICONDUCTOR, INC.
- John G. Maltabes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Assembly comprising a plurality of mask containers, manufacturing s...
- Patent number 6,895,294
- Issue date May 17, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Karl Emerson Mautz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for adjusting processing parameters of at least one plate-sh...
- Patent number 6,892,108
- Issue date May 10, 2005
- Infineon Technologies SC300 GmbH & Co. KG
- Karl Mautz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Configuration and a method for reducing contamination with particle...
- Patent number 6,881,264
- Issue date Apr 19, 2005
- Infineon Technologies AG
- Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing system method for processing a lithography mask conta...
- Patent number 6,817,602
- Issue date Nov 16, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Alain Charles
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for IN SITU measuring a required feature of a...
- Patent number 6,801,322
- Issue date Oct 5, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Karl Mautz
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer identification
- Patent number 6,759,248
- Issue date Jul 6, 2004
- Motorola, Inc.
- Karl Mautz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Continuously adjustable neutral density area filter
- Patent number 6,744,494
- Issue date Jun 1, 2004
- Motorola, Inc.
- John Maltabes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Arrangement and method for transferring a pattern from a mask to a...
- Patent number 6,737,205
- Issue date May 18, 2004
- Motorola, Inc.
- John George Maltabes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for monitoring a polishing condition of a surf...
- Patent number 6,709,312
- Issue date Mar 23, 2004
- Motorola, Inc.
- Karl E. Mautz
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor structure and method for reducing charge damage
- Patent number 6,686,254
- Issue date Feb 3, 2004
- Motorola, Inc.
- Joseph Petrucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for determining a thickness of a layer
- Patent number 6,671,059
- Issue date Dec 30, 2003
- Motorola, Inc.
- Larry Frisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer carrier transport system for tool bays
- Patent number 6,663,340
- Issue date Dec 16, 2003
- Motorola, Inc.
- Jason S. Zeakes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography method for forming semiconductor devices on a wafer uti...
- Patent number 6,620,563
- Issue date Sep 16, 2003
- Motorola, Inc.
- John George Maltabes
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for clamping a semiconductor device in a manufacturing process
- Patent number 6,593,254
- Issue date Jul 15, 2003
- Infineon Technologies AG
- Manfred Kraxenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chemical mechanical polishing (CMP) with altering the co...
- Patent number 6,589,099
- Issue date Jul 8, 2003
- Motorola, Inc.
- David Weston Haggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-controlled chuck and method for controlling the tempera...
- Patent number 6,495,802
- Issue date Dec 17, 2002
- Motorola, Inc.
- John G. Maltabes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for determining a thickness of a layer
- Patent number 6,472,237
- Issue date Oct 29, 2002
- Motorola, Inc.
- Larry Frisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-enhanced chemical vapor deposition (CVD) method to fill a tr...
- Patent number 6,362,098
- Issue date Mar 26, 2002
- Motorola, Inc.
- Terry Alan Breeden
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for measuring a characteristic of a semiconductor wafer usin...
- Patent number 5,982,166
- Issue date Nov 9, 1999
- Motorola, Inc.
- Karl Emerson Mautz
- G01 - MEASURING TESTING
Information Patent Grant
Method for reducing particles on a substrate using chuck cleaning
- Patent number 5,966,635
- Issue date Oct 12, 1999
- Motorola, Inc.
- W. Mark Hiatt
- B08 - CLEANING
Information Patent Grant
Method and apparatus for processing a semiconductor wafer on a robo...
- Patent number 5,963,315
- Issue date Oct 5, 1999
- Motorola, Inc.
- William Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing particles deposited onto a semiconductor wafer...
- Patent number 5,945,354
- Issue date Aug 31, 1999
- Motorola, Inc.
- Karl Emerson Mautz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor wafer processing chamber for reducing particles depos...
- Patent number 5,904,800
- Issue date May 18, 1999
- Motorola, Inc.
- Karl Emerson Mautz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing photo resist
- Patent number 5,496,438
- Issue date Mar 5, 1996
- Motorola, Inc.
- Phil Wootton
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for etching an insulating layer after a metal etching step
- Patent number 5,476,816
- Issue date Dec 19, 1995
- Motorola, Inc.
- Karl E. Mautz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled isotropy reactive ion etcher for multi-stepped sloped co...
- Patent number 5,250,165
- Issue date Oct 5, 1993
- Motorola, Inc.
- Robert Berglund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped contact etch process
- Patent number 4,902,377
- Issue date Feb 20, 1990
- Motorola, Inc.
- Robert K. Berglund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped contact etch process
- Patent number 4,698,128
- Issue date Oct 6, 1987
- Motorola, Inc.
- Robert K. Berglund
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Configuration and a method for reducing contamination with particle...
- Publication number 20040154530
- Publication date Aug 12, 2004
- Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for adjusting processing parameters of at least one plate-sh...
- Publication number 20040125191
- Publication date Jul 1, 2004
- Karl Mautz
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for defining alignment marks in a semiconductor wafer
- Publication number 20040072438
- Publication date Apr 15, 2004
- John G. Maltabes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
System and method for monitoring ion implantation processing
- Publication number 20040031934
- Publication date Feb 19, 2004
- William Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for monitoring a polishing condition of a surf...
- Publication number 20040002289
- Publication date Jan 1, 2004
- Karl E. Mautz
- B24 - GRINDING POLISHING
Information Patent Application
Method and system for cleaning a wafer chuck
- Publication number 20030200996
- Publication date Oct 30, 2003
- William Mark Hiatt
- B08 - CLEANING
Information Patent Application
Arrangement and method for transferring a pattern from a mask to a...
- Publication number 20030202181
- Publication date Oct 30, 2003
- John George Maltabes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method and apparatus for measuring a required feature of a layer du...
- Publication number 20030112451
- Publication date Jun 19, 2003
- Karl Mautz
- B24 - GRINDING POLISHING
Information Patent Application
Continuously adjustable neutral density area filter
- Publication number 20030107720
- Publication date Jun 12, 2003
- John Maltabes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Wafer scribing method and wafer scribing device
- Publication number 20030109141
- Publication date Jun 12, 2003
- Motorola, Inc. Semiconductor 300 GmbH & Co. KG
- Martin Peiter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of processing a semiconductor wafer and preprocessed semicon...
- Publication number 20030082857
- Publication date May 1, 2003
- Tim Stanley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for determining a thickness of a layer
- Publication number 20030082840
- Publication date May 1, 2003
- Larry Frisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for monitoring a semiconductor wafer plasma etch...
- Publication number 20030082838
- Publication date May 1, 2003
- Joseph Petrucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly comprising a plurality of mask containers, manufacturing s...
- Publication number 20030074097
- Publication date Apr 17, 2003
- Motorola, Inc., Semiconductor 300 GmbH & Co. KG, and Infineon Technologies AG.
- Karl Emerson Mautz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor wafer identification
- Publication number 20030064531
- Publication date Apr 3, 2003
- MOTOROLA, INC.
- Karl Mautz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for chemical mechanical polishing (CMP) with altering the co...
- Publication number 20030008599
- Publication date Jan 9, 2003
- MOTOROLA, INC.
- David Weston Haggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-CONTROLLED CHUCK AND METHOD FOR CONTROLLING THE TEMPERA...
- Publication number 20020179585
- Publication date Dec 5, 2002
- MOTOROLA, INC.
- John G. Maltabes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and method for reducing charge damage
- Publication number 20020158348
- Publication date Oct 31, 2002
- MOTOROLA, INC.
- Joseph Petrucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for clamping a semiconductor device in a manufacturing process
- Publication number 20020132393
- Publication date Sep 19, 2002
- Manfred Kraxenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithography method for forming semiconductor devices on a wafer and...
- Publication number 20020127482
- Publication date Sep 12, 2002
- MOTOROLA, INC.
- John George Maltabes
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Lithography method and apparatus with simplified reticles
- Publication number 20020127747
- Publication date Sep 12, 2002
- MOTOROLA, INC.
- John George Maltabes
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Lithography method for forming semiconductor devices with sub-micro...
- Publication number 20020127865
- Publication date Sep 12, 2002
- MOTOROLA, INC.
- John George Maltabes
- B82 - NANO-TECHNOLOGY
Information Patent Application
Electronic device for a lithography mask container, semiconductor m...
- Publication number 20020044266
- Publication date Apr 18, 2002
- Alain Charles
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Karl Emerson Mautz

Person

Patents Grantslast 30 patents

Wafer scribing method and wafer scribing device

Method for defining alignment marks in a semiconductor wafer

Assembly comprising a plurality of mask containers, manufacturing s...

Method for adjusting processing parameters of at least one plate-sh...

Configuration and a method for reducing contamination with particle...

Manufacturing system method for processing a lithography mask conta...

Method and apparatus for IN SITU measuring a required feature of a...

Semiconductor wafer identification

Continuously adjustable neutral density area filter

Arrangement and method for transferring a pattern from a mask to a...

Method and apparatus for monitoring a polishing condition of a surf...

Semiconductor structure and method for reducing charge damage

Method and system for determining a thickness of a layer

Wafer carrier transport system for tool bays

Lithography method for forming semiconductor devices on a wafer uti...

Method for clamping a semiconductor device in a manufacturing process

Method for chemical mechanical polishing (CMP) with altering the co...

Temperature-controlled chuck and method for controlling the tempera...

Method and system for determining a thickness of a layer

Plasma-enhanced chemical vapor deposition (CVD) method to fill a tr...

Method for measuring a characteristic of a semiconductor wafer usin...

Method for reducing particles on a substrate using chuck cleaning

Method and apparatus for processing a semiconductor wafer on a robo...

Method for reducing particles deposited onto a semiconductor wafer...

Semiconductor wafer processing chamber for reducing particles depos...

Method of removing photo resist

Process for etching an insulating layer after a metal etching step

Controlled isotropy reactive ion etcher for multi-stepped sloped co...

Sloped contact etch process

Sloped contact etch process

Patents Applicationslast 30 patents

Configuration and a method for reducing contamination with particle...

Method for adjusting processing parameters of at least one plate-sh...

Method for defining alignment marks in a semiconductor wafer

System and method for monitoring ion implantation processing

Method and apparatus for monitoring a polishing condition of a surf...

Method and system for cleaning a wafer chuck

Arrangement and method for transferring a pattern from a mask to a...

Method and apparatus for measuring a required feature of a layer du...

Continuously adjustable neutral density area filter

Wafer scribing method and wafer scribing device

Method of processing a semiconductor wafer and preprocessed semicon...

Method and system for determining a thickness of a layer

Method and system for monitoring a semiconductor wafer plasma etch...

Assembly comprising a plurality of mask containers, manufacturing s...

Semiconductor wafer identification

Method for chemical mechanical polishing (CMP) with altering the co...

TEMPERATURE-CONTROLLED CHUCK AND METHOD FOR CONTROLLING THE TEMPERA...

Semiconductor structure and method for reducing charge damage

Method for clamping a semiconductor device in a manufacturing process

Lithography method for forming semiconductor devices on a wafer and...

Lithography method and apparatus with simplified reticles

Lithography method for forming semiconductor devices with sub-micro...

Electronic device for a lithography mask container, semiconductor m...