Karl Heinz Priewasser

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of processing a substrate
- Patent number 12,094,751
- Issue date Sep 17, 2024
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wafer
- Patent number 11,894,271
- Issue date Feb 6, 2024
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 11,823,941
- Issue date Nov 21, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing with a protective film and peripheral adhesive
- Patent number 11,784,138
- Issue date Oct 10, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective sheet for use in processing wafer, handling system for w...
- Patent number 11,676,833
- Issue date Jun 13, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 11,637,074
- Issue date Apr 25, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 11,626,324
- Issue date Apr 11, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic system or device and method of manufacturing a microfl...
- Patent number 11,559,974
- Issue date Jan 24, 2023
- Disco Corporation
- Karl Heinz Priewasser
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method of processing wafer and protective sheeting for use in this...
- Patent number 11,437,275
- Issue date Sep 6, 2022
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 11,424,161
- Issue date Aug 23, 2022
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 11,201,126
- Issue date Dec 14, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 11,133,219
- Issue date Sep 28, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 11,011,406
- Issue date May 18, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer having protrusions on the back side
- Patent number 10,991,612
- Issue date Apr 27, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 10,991,623
- Issue date Apr 27, 2021
- Disco Corporation
- Masatoshi Wakahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dividing wafer
- Patent number 10,784,164
- Issue date Sep 22, 2020
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 10,727,128
- Issue date Jul 28, 2020
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing a substrate
- Patent number 10,727,127
- Issue date Jul 28, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing method
- Patent number 10,702,946
- Issue date Jul 7, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing a substrate
- Patent number 10,682,728
- Issue date Jun 16, 2020
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece processing method
- Patent number 10,475,676
- Issue date Nov 12, 2019
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 10,312,099
- Issue date Jun 4, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 10,256,148
- Issue date Apr 9, 2019
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer and wafer processing system
- Patent number 10,242,913
- Issue date Mar 26, 2019
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing method
- Patent number 10,032,669
- Issue date Jul 24, 2018
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer and wafer processing system
- Patent number 9,935,010
- Issue date Apr 3, 2018
- Disco Corporation
- Karl Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective sheeting for use in processing a semiconductor-sized waf...
- Patent number 9,905,453
- Issue date Feb 27, 2018
- Disco Corporation
- Karl Heinz Priewasser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of processing a substrate
- Patent number 9,831,128
- Issue date Nov 28, 2017
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support plate and method for forming support plate
- Patent number 9,768,049
- Issue date Sep 19, 2017
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20230072652
- Publication date Mar 9, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE AND SYSTEM FOR PROCESSING A SUBSTRATE
- Publication number 20220331899
- Publication date Oct 20, 2022
- Disco Corporation
- Karl Heinz PRIEWASSER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20220028742
- Publication date Jan 27, 2022
- Disco Corporation
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE
- Publication number 20210358736
- Publication date Nov 18, 2021
- Disco Corporation
- Karl Heinz PRIEWASSER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20210183704
- Publication date Jun 17, 2021
- Disco Corporation
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20210151390
- Publication date May 20, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20210035846
- Publication date Feb 4, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WORKPIECE AND SYSTEM FOR PROCESSING A WORKPIECE
- Publication number 20200381303
- Publication date Dec 3, 2020
- Disco Corporation
- Hitoshi HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SHEET FOR USE IN PROCESSING WAFER, HANDLING SYSTEM FOR W...
- Publication number 20200373176
- Publication date Nov 26, 2020
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20200312717
- Publication date Oct 1, 2020
- Disco Corporation
- Karl Heinz PRIEWASSER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER HAVING PROTRUSIONS ON THE BACK SIDE
- Publication number 20200273739
- Publication date Aug 27, 2020
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE
- Publication number 20200251431
- Publication date Aug 6, 2020
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20200185227
- Publication date Jun 11, 2020
- Disco Corporation
- Masatoshi WAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20200066569
- Publication date Feb 27, 2020
- Disco Corporation
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20190252254
- Publication date Aug 15, 2019
- Disco Corporation
- Karl Heinz PRIEWASSER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20190221480
- Publication date Jul 18, 2019
- Disco Corporation
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC SYSTEM OR DEVICE AND METHOD OF MANUFACTURING A MICROFL...
- Publication number 20190091649
- Publication date Mar 28, 2019
- Disco Corporation
- Karl Heinz Priewasser
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20190030648
- Publication date Jan 31, 2019
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20180342408
- Publication date Nov 29, 2018
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20180337141
- Publication date Nov 22, 2018
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20180315610
- Publication date Nov 1, 2018
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER AND PROTECTIVE SHEETING FOR USE IN THIS...
- Publication number 20180247870
- Publication date Aug 30, 2018
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM
- Publication number 20180211877
- Publication date Jul 26, 2018
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20180204771
- Publication date Jul 19, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20180161921
- Publication date Jun 14, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE SHEETING FOR USE IN PROCESSING A SEMICONDUCTOR-SIZED WAF...
- Publication number 20180005862
- Publication date Jan 4, 2018
- Karl Heinz PRIEWASSER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM
- Publication number 20170365519
- Publication date Dec 21, 2017
- Disco Corporation
- Karl Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20170076983
- Publication date Mar 16, 2017
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20170062278
- Publication date Mar 2, 2017
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PLATE AND METHOD FOR FORMING SUPPORT PLATE
- Publication number 20170047241
- Publication date Feb 16, 2017
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS

Karl Heinz Priewasser

Person

Patents Grantslast 30 patents

Method of processing a substrate

Method of producing a substrate and system for producing a substrate

Method of processing wafer

Method of processing a substrate

Wafer processing with a protective film and peripheral adhesive

Protective sheet for use in processing wafer, handling system for w...

Method of processing wafer

Method of processing a wafer

Microfluidic system or device and method of manufacturing a microfl...

Method of processing wafer and protective sheeting for use in this...

Substrate processing method

Method of producing a substrate and system for producing a substrate

Method of processing a wafer

Method of processing a substrate

Method of processing wafer having protrusions on the back side

Wafer processing method

Method of dividing wafer

Method of processing a wafer

Method of processing a substrate

Substrate processing method

Method of processing a substrate

Workpiece processing method

Wafer processing method

Method of processing wafer

Method of processing a wafer and wafer processing system

Wafer dividing method

Method of processing a wafer and wafer processing system

Protective sheeting for use in processing a semiconductor-sized waf...

Method of processing a substrate

Support plate and method for forming support plate

Patents Applicationslast 30 patents

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING A SUBSTRATE AND SYSTEM FOR PROCESSING A SUBSTRATE

METHOD OF PROCESSING WAFER

METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE

METHOD OF PROCESSING A WAFER

METHOD OF PROCESSING WAFER

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING A WORKPIECE AND SYSTEM FOR PROCESSING A WORKPIECE

PROTECTIVE SHEET FOR USE IN PROCESSING WAFER, HANDLING SYSTEM FOR W...

SUBSTRATE PROCESSING METHOD

METHOD OF PROCESSING WAFER HAVING PROTRUSIONS ON THE BACK SIDE

METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE

WAFER PROCESSING METHOD

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING A WAFER

METHOD OF PROCESSING A WAFER

MICROFLUIDIC SYSTEM OR DEVICE AND METHOD OF MANUFACTURING A MICROFL...

METHOD OF PROCESSING A SUBSTRATE

WORKPIECE PROCESSING METHOD

METHOD OF PROCESSING WAFER

WAFER PROCESSING METHOD

METHOD OF PROCESSING WAFER AND PROTECTIVE SHEETING FOR USE IN THIS...

METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM

METHOD OF PROCESSING A SUBSTRATE

SUBSTRATE PROCESSING METHOD

PROTECTIVE SHEETING FOR USE IN PROCESSING A SEMICONDUCTOR-SIZED WAF...

METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING WAFER

SUPPORT PLATE AND METHOD FOR FORMING SUPPORT PLATE