Karl-Heinz SCHERF

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Eppstein, DE

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Patents Grantslast 30 patents

Information Patent Grant
Potted electronic module with improved adhesion of potting compound
- Patent number 11,470,736
- Issue date Oct 11, 2022
- Continental Automotive GmbH
- Henryk Frenzel
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing a potted electronic module
- Patent number 10,136,533
- Issue date Nov 20, 2018
- Continental Teves AG & Co. oHG
- Henryk Frenzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Potted Electronic Module with Improved Adhesion of Potting Compound
- Publication number 20190075670
- Publication date Mar 7, 2019
- Continental Teves AG & Co. OHG
- Henryk Frenzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module
- Publication number 20170164493
- Publication date Jun 8, 2017
- Continental Teves AG & Co. oHG
- Henryk FRENZEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR