Karl J. Puttlitz

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,964,885
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free tin-silver-copper alloy solder composition
- Patent number 6,805,974
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Won K. Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive and abrasion/scratch resistant polymeric ma...
- Patent number 6,746,770
- Issue date Jun 8, 2004
- Internatonal Business Machines Corporation
- Ali Afzali-Ardakani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,703,560
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical attachment means used as electrical connection
- Patent number 6,287,126
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Michael Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero force heat sink
- Patent number 6,212,070
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing circuit boards
- Patent number 6,179,196
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Craig G. Heim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 6,070,782
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for replacing a first area array component connected to an i...
- Patent number 6,068,175
- Issue date May 30, 2000
- International Business Machines Corporation
- Craig G. Heim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 5,868,304
- Issue date Feb 9, 1999
- International Business Machines Corporation
- Peter Jeffrey Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for restraining circuit board warp during area array rework
- Patent number 5,862,588
- Issue date Jan 26, 1999
- International Business Machines Corporation
- Craig G. Heim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero force heat sink
- Patent number 5,805,430
- Issue date Sep 8, 1998
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive and abrasion/scratch resistant polymeric ma...
- Patent number 5,721,299
- Issue date Feb 24, 1998
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Apparatus and method for removing meltable material from a substrate
- Patent number 5,620,132
- Issue date Apr 15, 1997
- International Business Machines Corporation
- Andrew J. Downing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing meltable material from a substrate
- Patent number 5,458,281
- Issue date Oct 17, 1995
- International Business Machines Corporation
- Andrew J. Downing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous metal block for removing solder or braze from a substate and...
- Patent number 5,284,286
- Issue date Feb 8, 1994
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making a porous metal block for removing solder or braze
- Patent number 5,219,520
- Issue date Jun 15, 1993
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnection structure for joining semiconductor devices...
- Patent number 4,604,644
- Issue date Aug 5, 1986
- International Business Machines Corporation
- Keith F. Beckham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Individual chip joining machine
- Patent number 4,160,893
- Issue date Jul 10, 1979
- International Business Machines Corporation
- Robert H. Meyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free tin-silver-copper alloy solder composition
- Publication number 20030156969
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Won K. Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS

Karl J. Puttlitz

Person

Patents Grantslast 30 patents

Stress resistant land grid array (LGA) module and method of forming...

Lead-free tin-silver-copper alloy solder composition

Electrically conductive and abrasion/scratch resistant polymeric ma...

Stress resistant land grid array (LGA) module and method of forming...

Mechanical attachment means used as electrical connection

Zero force heat sink

Apparatus for manufacturing circuit boards

Socketable bump grid array shaped-solder on copper spheres

System for replacing a first area array component connected to an i...

Socketable bump grid array shaped-solder on copper spheres

Method for restraining circuit board warp during area array rework

Zero force heat sink

Electrically conductive and abrasion/scratch resistant polymeric ma...

Apparatus and method for removing meltable material from a substrate

Method for removing meltable material from a substrate

Porous metal block for removing solder or braze from a substate and...

Method of forming dual height solder interconnections

Process of making a porous metal block for removing solder or braze

Solder mass having conductive encapsulating arrangement

Solder interconnection structure for joining semiconductor devices...

Individual chip joining machine

Patents Applicationslast 30 patents

Stress resistant land grid array (LGA) module and method of forming...

Lead-free tin-silver-copper alloy solder composition

Stress resistant land grid array (LGA) module and method of forming...