Karl Priewasser

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive sheet for backgrinding and production method for semicondu...
- Patent number 12,312,512
- Issue date May 27, 2025
- Disco Corporation
- Karl Heinz Priewasser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer thinning method
- Patent number 10,319,593
- Issue date Jun 11, 2019
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BACK GRINDING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICOND...
- Publication number 20220148905
- Publication date May 12, 2022
- DISCO CORPORATION
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Application
ADHESIVE SHEET FOR BACKGRINDING AND PRODUCTION METHOD FOR SEMICONDU...
- Publication number 20220135848
- Publication date May 5, 2022
- DISCO CORPORATION
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER THINNING METHOD
- Publication number 20170025275
- Publication date Jan 26, 2017
- Disco Corporation
- Kazuya Hirata
- H01 - BASIC ELECTRIC ELEMENTS