Karl W. Barth

Person

Beacon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding interface for 3-dimensional chip integration
- Patent number 8,349,729
- Issue date Jan 8, 2013
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse link structures using film stress for programming and methods...
- Patent number 8,236,655
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding interface for 3-dimensional chip integration
- Patent number 8,159,060
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse link structures using film stress for programming and methods...
- Patent number 8,089,105
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse link structures using film stress for programming and methods...
- Patent number 7,892,926
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect and IC chip including metal interconnect
- Patent number 7,851,919
- Issue date Dec 14, 2010
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect forming methods and IC chip including metal inte...
- Patent number 7,718,525
- Issue date May 18, 2010
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relaxation, selective nitride phase removal
- Patent number 7,541,277
- Issue date Jun 2, 2009
- International Business Machines Corporation
- Kevin Shawn Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for determining line widths of free-standing stru...
- Patent number 7,101,817
- Issue date Sep 5, 2006
- International Business Machines Corporation
- Stephen M. Lucarini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION
- Publication number 20120171818
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION
- Publication number 20110101537
- Publication date May 5, 2011
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS...
- Publication number 20110045644
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS...
- Publication number 20110042779
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS...
- Publication number 20110018091
- Publication date Jan 27, 2011
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT AND IC CHIP INCLUDING METAL INTERCONNECT
- Publication number 20100133694
- Publication date Jun 3, 2010
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING IC CHIP IN PORTIONS FOR LATER COMBINING, AND RELATED...
- Publication number 20090014868
- Publication date Jan 15, 2009
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT FORMING METHODS AND IC CHIP INCLUDING METAL INTE...
- Publication number 20090001592
- Publication date Jan 1, 2009
- International Business Machines Corporation
- Karl W. Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DETERMINING LINE WIDTHS OF FREE-STANDING STRU...
- Publication number 20060099832
- Publication date May 11, 2006
- International Business Machines Corporation
- Stephen M. Lucarini
- H01 - BASIC ELECTRIC ELEMENTS

Karl W. Barth

Person

Patents Grantslast 30 patents

Hybrid bonding interface for 3-dimensional chip integration

Fuse link structures using film stress for programming and methods...

Hybrid bonding interface for 3-dimensional chip integration

Fuse link structures using film stress for programming and methods...

Fuse link structures using film stress for programming and methods...

Metal interconnect and IC chip including metal interconnect

Metal interconnect forming methods and IC chip including metal inte...

Stress relaxation, selective nitride phase removal

System and method for determining line widths of free-standing stru...

Patents Applicationslast 30 patents

HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION

HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION

FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS...

FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS...

FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS...

METAL INTERCONNECT AND IC CHIP INCLUDING METAL INTERCONNECT

MANUFACTURING IC CHIP IN PORTIONS FOR LATER COMBINING, AND RELATED...

METAL INTERCONNECT FORMING METHODS AND IC CHIP INCLUDING METAL INTE...

SYSTEM AND METHOD FOR DETERMINING LINE WIDTHS OF FREE-STANDING STRU...