KARRTHIK PARATHITHASAN

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for warpage correction
- Patent number 11,871,667
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for handling various sized substrates
- Patent number 10,930,542
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive-less substrate bonding to carrier plate
- Patent number 10,847,400
- Issue date Nov 24, 2020
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridging front opening unified pod (FOUP)
- Patent number 10,504,762
- Issue date Dec 10, 2019
- Applied Materials, Inc.
- Karrthik Parathithasan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR WARPAGE CORRECTION
- Publication number 20220085268
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Sriskantharajah THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION
- Publication number 20210035795
- Publication date Feb 4, 2021
- Applied Materials, Inc.
- Qi Jie PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE-LESS SUBSTRATE BONDING TO CARRIER PLATE
- Publication number 20200211883
- Publication date Jul 2, 2020
- Applied Materials, Inc.
- SRISKANTHARAJAH THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT FOR PROCESSING REDUCED SIZED SUBSTRATES
- Publication number 20190259635
- Publication date Aug 22, 2019
- KARRTHIK PARATHITHASAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION RING FOR PROCESSING REDUCED SIZE SUBSTRATES
- Publication number 20190259647
- Publication date Aug 22, 2019
- SRISKANTHARAJAH THIRUNAVUKARASU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR HANDLING VARIOUS SIZED SUBSTRATES
- Publication number 20190252235
- Publication date Aug 15, 2019
- SRISKANTHARAJAH THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGING FRONT OPENING UNIFIED POD (FOUP)
- Publication number 20190244845
- Publication date Aug 8, 2019
- Applied Materials, Inc.
- KARRTHIK PARATHITHASAN
- H01 - BASIC ELECTRIC ELEMENTS

KARRTHIK PARATHITHASAN

Person

Patents Grantslast 30 patents

Methods and apparatus for warpage correction

Apparatus for handling various sized substrates

Adhesive-less substrate bonding to carrier plate

Bridging front opening unified pod (FOUP)

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR WARPAGE CORRECTION

METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION

ADHESIVE-LESS SUBSTRATE BONDING TO CARRIER PLATE

PROCESS KIT FOR PROCESSING REDUCED SIZED SUBSTRATES

DEPOSITION RING FOR PROCESSING REDUCED SIZE SUBSTRATES

APPARATUS FOR HANDLING VARIOUS SIZED SUBSTRATES

BRIDGING FRONT OPENING UNIFIED POD (FOUP)