Karsten Guth

Person

Soest, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 9,768,035
- Issue date Sep 19, 2017
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module, method for producing a power semiconduc...
- Patent number 9,214,442
- Issue date Dec 15, 2015
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die fixing method and apparatus
- Patent number 8,691,624
- Issue date Apr 8, 2014
- Infineon Technologies AG
- Alexander Ciliox
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device including a semiconductor chip and a carrier and fabrication...
- Patent number 8,637,379
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 8,603,864
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power semiconductor arrangement and method for producing a power se...
- Patent number 8,586,420
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor arrangement
- Patent number 8,563,364
- Issue date Oct 22, 2013
- Infineon Technologies AG
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for making a semiconductor device including bondi...
- Patent number 8,439,249
- Issue date May 14, 2013
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a sintered joint bonding a semiconductor chip to a...
- Patent number 8,415,207
- Issue date Apr 9, 2013
- Infineon Technologies AG
- Karsten Guth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Module including a sintered joint bonding a semiconductor chip to a...
- Patent number 8,253,233
- Issue date Aug 28, 2012
- Infineon Technologies AG
- Karsten Guth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for mounting electronic components on a support
- Patent number 8,209,858
- Issue date Jul 3, 2012
- Infineon Technologies AG
- Roland Speckels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for connecting a component with a substrate
- Patent number 8,104,667
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for producing semiconductor modules
- Patent number 7,851,334
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for connecting a component with a substrate
- Patent number 7,793,819
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of a semiconductor component
- Patent number 7,757,390
- Issue date Jul 20, 2010
- Infineon Techologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a module including a sintered joint
- Patent number 7,682,875
- Issue date Mar 23, 2010
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip attachment
- Patent number 7,555,832
- Issue date Jul 7, 2009
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE
- Publication number 20230411254
- Publication date Dec 21, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module and Method for Producing an Electronic Module
- Publication number 20160104631
- Publication date Apr 14, 2016
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Fixing Method and Apparatus
- Publication number 20130137215
- Publication date May 30, 2013
- Alexander Ciliox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING A POWER SE...
- Publication number 20130082387
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR ARRANGEMENT
- Publication number 20130084679
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...
- Publication number 20120312864
- Publication date Dec 13, 2012
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...
- Publication number 20110084369
- Publication date Apr 14, 2011
- INFINEON TECHNOLOGIES AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Connecting a Component With a Substrate
- Publication number 20110017803
- Publication date Jan 27, 2011
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...
- Publication number 20100078463
- Publication date Apr 1, 2010
- INFINEON TECHNOLOGIES AG
- Roland SPECKELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE INCLUDING A STABLE SOLDER JOINT
- Publication number 20100068552
- Publication date Mar 18, 2010
- INFINEON TECHNOLOGIES AG
- Jens Goerlich
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20100059857
- Publication date Mar 11, 2010
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MODULE INCLUDING A SINTERED JOINT
- Publication number 20090294963
- Publication date Dec 3, 2009
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...
- Publication number 20090206456
- Publication date Aug 20, 2009
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR MODULES
- Publication number 20090023250
- Publication date Jan 22, 2009
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CONNECTING A COMPONENT WITH A SUBSTRATE
- Publication number 20080230589
- Publication date Sep 25, 2008
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Attachment
- Publication number 20080229575
- Publication date Sep 25, 2008
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module, Method for Producing a Power Semiconduc...
- Publication number 20080230905
- Publication date Sep 25, 2008
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Head, Bonding Tool and Method for Production of a Semicondu...
- Publication number 20080005893
- Publication date Jan 10, 2008
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement For Mounting Electronic Components On A Support
- Publication number 20070175021
- Publication date Aug 2, 2007
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS

Karsten Guth

Person

Patents Grantslast 30 patents

Electronic module and method for producing an electronic module

Power semiconductor module, method for producing a power semiconduc...

Die fixing method and apparatus

Device including a semiconductor chip and a carrier and fabrication...

Method of fabricating a semiconductor device

Power semiconductor arrangement and method for producing a power se...

Method for producing a power semiconductor arrangement

Device and method for making a semiconductor device including bondi...

Module including a sintered joint bonding a semiconductor chip to a...

Module including a sintered joint bonding a semiconductor chip to a...

Method for mounting electronic components on a support

Method for connecting a component with a substrate

Apparatus and method for producing semiconductor modules

Apparatus and method for connecting a component with a substrate

Method for production of a semiconductor component

Method for fabricating a module including a sintered joint

Semiconductor chip attachment

Patents Applicationslast 30 patents

MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE

Electronic Module and Method for Producing an Electronic Module

Die Fixing Method and Apparatus

POWER SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING A POWER SE...

METHOD FOR PRODUCING A POWER SEMICONDUCTOR ARRANGEMENT

MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...

Method for Connecting a Component With a Substrate

DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...

MODULE INCLUDING A STABLE SOLDER JOINT

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

MODULE INCLUDING A SINTERED JOINT

MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...

APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR MODULES

APPARATUS AND METHOD FOR CONNECTING A COMPONENT WITH A SUBSTRATE

Semiconductor Chip Attachment

Power Semiconductor Module, Method for Producing a Power Semiconduc...

Bonding Head, Bonding Tool and Method for Production of a Semicondu...

Arrangement For Mounting Electronic Components On A Support