Kartik SRINIVASAN

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 12,176,318
- Issue date Dec 24, 2024
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 11,652,080
- Issue date May 16, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20230238352
- Publication date Jul 27, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20210288021
- Publication date Sep 16, 2021
- Intel Corporation
- Mihir Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE TCB BY DATA FEED FORWARD
- Publication number 20170154828
- Publication date Jun 1, 2017
- Intel Corporation
- Timothy A. GOSSELIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kartik SRINIVASAN

Person

Patents Grantslast 30 patents

Thermal compression bonder nozzle with vacuum relief features

Thermal compression bonder nozzle with vacuum relief features

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

CONTROLLING SUBSTRATE BUMP HEIGHT

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

ADAPTIVE TCB BY DATA FEED FORWARD