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Katherine G. Heinen
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Dallas, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Wafer-scale assembly of chip-size packages
Patent number
6,730,541
Issue date
May 4, 2004
Texas Instruments Incorporated
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid assembly with solder columns
Patent number
6,528,873
Issue date
Mar 4, 2003
Texas Instruments Incorporated
Katherine G. Heinen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer-scale assembly of chip-size packages
Patent number
6,432,744
Issue date
Aug 13, 2002
Texas Instruments Incorporated
Gonzalo Amador
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid assembly with solder columns
Patent number
6,251,767
Issue date
Jun 26, 2001
Texas Instruments Incorporated
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for positioning a carrier relative to a travel path
Patent number
6,234,296
Issue date
May 22, 2001
Texas Instruments Incorporated
Gonzalo Amador
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for applying a rotary force to strips of varying widths
Patent number
6,227,353
Issue date
May 8, 2001
Texas Instruments Incorporated
Gonzalo Amador
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radiant chamber for simultaneous rapid die attach and lead frame em...
Patent number
6,226,452
Issue date
May 1, 2001
Texas Instruments Incorporated
Paul Joseph Hundt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress relief matrix for integrated circuit packaging
Patent number
6,096,578
Issue date
Aug 1, 2000
Texas Instruments Incorporated
Elizabeth G. Jacobs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Automated multiple lead frame strip radiant die attach material cur...
Patent number
6,069,342
Issue date
May 30, 2000
Texas Instruments Incorporated
Gonzalo Amador
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a packaged semiconductor device and a lead-frame t...
Patent number
6,030,859
Issue date
Feb 29, 2000
Hitachi, Ltd.
Ichiro Anjoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame for integrated circuits and process of packaging
Patent number
5,994,169
Issue date
Nov 30, 1999
Texas Instruments Incorporated
Michael Anthony Lamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coring of leadframes in carriers via radiant heat source
Patent number
5,993,591
Issue date
Nov 30, 1999
Texas Instruments Incorporated
Jesus S. Buendia
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Stress relief matrix for integrated circuit packaging
Patent number
5,894,173
Issue date
Apr 13, 1999
Texas Instruments Incorporated
Elizabeth G. Jacobs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process of packaging an integrated circuit with a conductive materi...
Patent number
5,840,599
Issue date
Nov 24, 1998
Texas Instruments Incorporated
Michael Anthony Lamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced molded cavity package having a parallel lid
Patent number
5,650,915
Issue date
Jul 22, 1997
Texas Instruments Incorporated
Rafael Cesar Alfaro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and a leadframe therefor
Patent number
5,648,299
Issue date
Jul 15, 1997
Hitachi, Ltd.
Ichiro Anjoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and a leadframe therefor
Patent number
5,585,665
Issue date
Dec 17, 1996
Hitachi, Ltd.
Ichiro Anjoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for manufacturing a thermally enhanced molded cavity packag...
Patent number
5,458,716
Issue date
Oct 17, 1995
Texas Instruments Incorporated
Rafael C. Alfaro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and a lead frame therefor, having a c...
Patent number
5,442,233
Issue date
Aug 15, 1995
Hitachi, Ltd.
Ichiro Anjoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making a balanced capacitance lead frame for integrated...
Patent number
5,432,127
Issue date
Jul 11, 1995
Texas Instruments Incorporated
Michael A. Lamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for enhancing adhesion capability of heat spreaders in mo...
Patent number
5,422,788
Issue date
Jun 6, 1995
Texas Instruments Incorporated
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device and method to prevent cracking during sur...
Patent number
5,418,189
Issue date
May 23, 1995
Texas Instruments Incorporated
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for enhancing adhesion capability of heat spreaders in mo...
Patent number
5,362,680
Issue date
Nov 8, 1994
Texas Instruments Incorporated
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Insulated lead frame for integrated circuits and method of manufact...
Patent number
5,359,224
Issue date
Oct 25, 1994
Texas Instruments Incorporated
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module testing
Patent number
5,321,277
Issue date
Jun 14, 1994
Texas Instruments Incorporated
Steve E. Sparks
G01 - MEASURING TESTING
Information
Patent Grant
Balanced capacitance lead frame for integrated circuits and integra...
Patent number
5,233,220
Issue date
Aug 3, 1993
Texas Instruments Incorporated
Michael A. Lamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device having an aminopropyltriethoxysilane coating
Patent number
5,227,661
Issue date
Jul 13, 1993
Texas Instruments Incorporated
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Ball grid assembly with solder columns
Publication number
20030027415
Publication date
Feb 6, 2003
Katherine G. Heinen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-SCALE ASSEMBY OF CHIP-SIZE PACKAGES
Publication number
20010044197
Publication date
Nov 22, 2001
KATHERINE G. HEINEN
H01 - BASIC ELECTRIC ELEMENTS