Kathleen C. Yu

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a multiple thickness interconnect
- Patent number 7,176,574
- Issue date Feb 13, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a transistor and a capacitor having...
- Patent number 7,122,421
- Issue date Oct 17, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Hector Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a gate electrode having a metal
- Patent number 7,030,001
- Issue date Apr 18, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Olubunmi O. Adetutu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having electrical contact from opposite sides...
- Patent number 6,921,961
- Issue date Jul 26, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Hector Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having electrical contact...
- Patent number 6,838,332
- Issue date Jan 4, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Hector Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a passivation layer for air gap formation
- Patent number 6,838,354
- Issue date Jan 4, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Cindy K. Goldberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor interconnect with multiple thick...
- Patent number 6,815,820
- Issue date Nov 9, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a dummy feature and structure thereof
- Patent number 6,764,919
- Issue date Jul 20, 2004
- Motorola, Inc.
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,313,024
- Issue date Nov 6, 2001
- Motorola, Inc.
- Nigel G. Cave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a support structure
- Patent number 6,037,668
- Issue date Mar 14, 2000
- Motorola, Inc.
- Nigel G. Cave
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor fabrication process employing spacer defined vias
- Publication number 20070072334
- Publication date Mar 29, 2007
- Freescale Semiconductor, Inc.
- Marius K. Orlowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a gate electrode having a metal
- Publication number 20050233562
- Publication date Oct 20, 2005
- Olubunmi O. Adetutu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device having electrical contact from opposite sides
- Publication number 20050042867
- Publication date Feb 24, 2005
- Hector Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multiple thickness interconnect
- Publication number 20050035459
- Publication date Feb 17, 2005
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING A DUMMY FEATURE AND STRUCTURE THEREOF
- Publication number 20040121577
- Publication date Jun 24, 2004
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a passivation layer for air gap formation and st...
- Publication number 20040119134
- Publication date Jun 24, 2004
- Cindy K. Goldberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple thickness semiconductor interconnect and method therefor
- Publication number 20030209779
- Publication date Nov 13, 2003
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS

Kathleen C. Yu

Person

Patents Grantslast 30 patents

Semiconductor device having a multiple thickness interconnect

Semiconductor device including a transistor and a capacitor having...

Method for forming a gate electrode having a metal

Semiconductor device having electrical contact from opposite sides...

Method for forming a semiconductor device having electrical contact...

Method for forming a passivation layer for air gap formation

Method for forming a semiconductor interconnect with multiple thick...

Method for providing a dummy feature and structure thereof

Method for forming a semiconductor device

Integrated circuit having a support structure

Patents Applicationslast 30 patents

Semiconductor fabrication process employing spacer defined vias

Method for forming a gate electrode having a metal

Semiconductor device having electrical contact from opposite sides

Semiconductor device having a multiple thickness interconnect

METHOD FOR PROVIDING A DUMMY FEATURE AND STRUCTURE THEREOF

Method for forming a passivation layer for air gap formation and st...

Multiple thickness semiconductor interconnect and method therefor