Kathleen M. McGuire

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and process for thin film interconnect
- Patent number 6,228,511
- Issue date May 8, 2001
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for thin film interconnect
- Patent number 6,165,629
- Issue date Dec 26, 2000
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for screening using electrostatic adhesion
- Patent number 5,891,543
- Issue date Apr 6, 1999
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for screening green sheet with via hole using...
- Patent number 5,759,669
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Jon Alfred Casey
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for screening using electrostatic adhesion
- Patent number 5,635,000
- Issue date Jun 3, 1997
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film interconnect
- Patent number 5,231,751
- Issue date Aug 3, 1993
- International Business Machines Corporation
- Krishna G. Sachdev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnection structure for joining semiconductor devices...
- Patent number 4,604,644
- Issue date Aug 5, 1986
- International Business Machines Corporation
- Keith F. Beckham
- H01 - BASIC ELECTRIC ELEMENTS

Kathleen M. McGuire

Person

Patents Grantslast 30 patents

Structure and process for thin film interconnect

Structure for thin film interconnect

Apparatus and method for screening using electrostatic adhesion

Apparatus and method for screening green sheet with via hole using...

Method for screening using electrostatic adhesion

Process for thin film interconnect

Solder interconnection structure for joining semiconductor devices...