Kathryn Ann Schuck

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Immersion plating treatments for indium passivation
- Patent number 11,535,945
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and system for electroplating a MEMS device
- Patent number 11,230,783
- Issue date Jan 25, 2022
- Texas Instruments Incorporated
- Donald Charles Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nickel lanthanide alloys for MEMS packaging applications
- Patent number 11,091,366
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package moisture control and leak mitigation for high vacuum sealed...
- Patent number 10,968,099
- Issue date Apr 6, 2021
- Texas Instruments Incorporated
- Kathryn Anne Schuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for electroplating a MEMS device
- Patent number 10,704,156
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Donald Charles Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nickel lanthanide alloys for mems packaging applications
- Patent number 10,544,034
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE
- Publication number 20220212919
- Publication date Jul 7, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jennifer Lynne HOLM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IMMERSION PLATING TREATMENTS FOR INDIUM PASSIVATION
- Publication number 20210198798
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR ELECTTROPLATING A MEMS DEVICE
- Publication number 20200291539
- Publication date Sep 17, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Donald Charles Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE MOISTURE CONTROL AND LEAK MITIGATION FOR HIGH VACUUM SEALED...
- Publication number 20200207614
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kathryn Anne Schuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200165124
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200024130
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR ELECTROPLATING A MEMS DEVICE
- Publication number 20170175283
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Donald Charles Abbott
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kathryn Ann Schuck

Person

Patents Grantslast 30 patents

Immersion plating treatments for indium passivation

Method and system for electroplating a MEMS device

Nickel lanthanide alloys for MEMS packaging applications

Package moisture control and leak mitigation for high vacuum sealed...

Method and system for electroplating a MEMS device

Nickel lanthanide alloys for mems packaging applications

Patents Applicationslast 30 patents

BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE

IMMERSION PLATING TREATMENTS FOR INDIUM PASSIVATION

METHOD AND SYSTEM FOR ELECTTROPLATING A MEMS DEVICE

PACKAGE MOISTURE CONTROL AND LEAK MITIGATION FOR HIGH VACUUM SEALED...

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

METHOD AND SYSTEM FOR ELECTROPLATING A MEMS DEVICE