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Katie Yu
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Austin, TX, US
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last 30 patents
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Patent Grant
Die level metal density gradient for improved flip chip package rel...
Patent number
7,276,435
Issue date
Oct 2, 2007
FREESCALE SEMICONDUCTOR, INC.
Scott K. Pozder
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
INTEGRATED SYSTEM FOR SEMICONDUCTOR SUBSTRATE PROCESSING USING LIQU...
Publication number
20090301867
Publication date
Dec 10, 2009
CITIBANK N.A.
Janos Farkas
H01 - BASIC ELECTRIC ELEMENTS