Katsufumi Morimune

Follow

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Crack growth evaluation apparatus, crack growth evaluation method,...
- Patent number 8,190,378
- Issue date May 29, 2012
- Fujitsu Limited
- Hidehisa Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Die bonding apparatus
- Patent number 7,308,999
- Issue date Dec 18, 2007
- Fujitsu Ten Limited
- Toshihiko Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 7,120,024
- Issue date Oct 10, 2006
- Fujitsu Ten Limited
- Hiromichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding apparatus
- Patent number 6,708,862
- Issue date Mar 23, 2004
- Fujitsu Ten Limited
- Toshihiko Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Crack growth evaluation apparatus, crack growth evaluation method,...
- Publication number 20090187353
- Publication date Jul 23, 2009
- FUJITSU LIMITED
- Hidehisa Sakai
- G01 - MEASURING TESTING
Information Patent Application
Electronic control device
- Publication number 20050190539
- Publication date Sep 1, 2005
- Hiromichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die bonding apparatus
- Publication number 20040129758
- Publication date Jul 8, 2004
- FUJITSU TEN LIMITED
- Toshihiko Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die bonding apparatus
- Publication number 20030024963
- Publication date Feb 6, 2003
- FUJITSU TEN LIMITED
- Toshihiko Fujii
- H01 - BASIC ELECTRIC ELEMENTS