Katsuhiko Hayashi

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mold release layer transferring film and laminate film
- Patent number 7,255,919
- Issue date Aug 14, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a COF flexible printed wiring board
- Patent number 7,198,989
- Issue date Apr 3, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
COF flexible printed wiring board and method of producing the wirin...
- Patent number 7,173,322
- Issue date Feb 6, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2-Metal layer TAB tape and both-sided CSP•BGA tape
- Patent number 6,798,048
- Issue date Sep 28, 2004
- Mitsui Mining and Smelting Company, Ltd.
- Akira Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING TH...
- Publication number 20100244281
- Publication date Sep 30, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Katsuhiko HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COF FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20080251947
- Publication date Oct 16, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer stacked wiring board
- Publication number 20070169960
- Publication date Jul 26, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Katsuhiko Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COF flexible printed wiring board and semiconductor device
- Publication number 20050205972
- Publication date Sep 22, 2005
- MITSUI MINING AND SMELTING CO., LTD
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing a COF flexible printed wiring board
- Publication number 20050181541
- Publication date Aug 18, 2005
- MITSUI MINING AND SMELTING CO., LTD
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold release layer transferring film and laminate film
- Publication number 20050167818
- Publication date Aug 4, 2005
- Mitsui Mining and Smelting Co., Ltd.
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board,its manufacturing method and csp manufacturin...
- Publication number 20040099441
- Publication date May 27, 2004
- Akira Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and production method therefor, and laminated...
- Publication number 20040026122
- Publication date Feb 12, 2004
- Katsuhiko Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COF flexible printed wiring board and method of producing the wirin...
- Publication number 20040004823
- Publication date Jan 8, 2004
- MITSUI MINING AND SMELTING CO., LTD
- Ken Sakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Two-metal tab tape, double-sided csp tape, bga tape and method for...
- Publication number 20020187334
- Publication date Dec 12, 2002
- Akira Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS

Katsuhiko Hayashi

Person

Patents Grantslast 30 patents

Mold release layer transferring film and laminate film

Method of producing a COF flexible printed wiring board

COF flexible printed wiring board and method of producing the wirin...

2-Metal layer TAB tape and both-sided CSP&#x02022;BGA tape

Patents Applicationslast 30 patents

FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING TH...

COF FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

Multilayer stacked wiring board

COF flexible printed wiring board and semiconductor device

Method of producing a COF flexible printed wiring board

Mold release layer transferring film and laminate film

Printed circuit board,its manufacturing method and csp manufacturin...

Printed circuit board and production method therefor, and laminated...

COF flexible printed wiring board and method of producing the wirin...

Two-metal tab tape, double-sided csp tape, bga tape and method for...

2-Metal layer TAB tape and both-sided CSP•BGA tape